Strasbaugh
6 CG 60" Lapper
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Strasbaugh 6 CG 60" Lapper is a dicing and grinding machine. The Strasbaugh 6 CG 60" Lapper is a lapper / grinder. The Strasbaugh 6 CG 60" Lapper is rated for 1 phase, 50/60 Hz, and 208V.[1][2]
What it is
How it works
General reference — not yet source-verifiedA lapper removes material by holding a workpiece against an abrasive surface while motion between the workpiece and the abrasive produces controlled planarization.
A grinding machine removes material by controlled abrasive contact to reduce thickness, correct flatness, or prepare a surface for later singulation or finishing steps.
Where it fits in the process flow
General reference — not yet source-verifiedThe machine belongs to backend wafer processing rather than front end transistor fabrication.
Applications
The Strasbaugh 6 CG 60" Lapper is used for lapping and grinding tasks in semiconductor manufacturing.[1]
What do the numbers mean?
Power & electrical3
- 50/60 Hz[2]
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How is lapping different from dicing?General reference — not yet source-verified
Lapping is a surface-finishing and thinning process applied across the face of a part, while dicing separates a processed wafer or substrate into individual pieces. The two processes serve different roles in the manufacturing flow.
What types of materials are commonly processed on lapping systems?General reference — not yet source-verified
Such systems are commonly used on silicon, compound semiconductor materials, glass, sapphire, ceramics, and other hard or brittle substrates. The general requirement is a need for controlled material removal with attention to flatness and surface integrity.
Not publicly documented
The following facts about the 6 CG 60" Lapper are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6 CG 60" Lapper are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6 CG 60" Lapper are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6 CG 60" Lapper are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6 CG 60" Lapper are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6 CG 60" Lapper is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Inventory photo
Last updated Oct 19, 2026.
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