Sumitomo
SE 130 DU CI Injection
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedInjection molding machines for semiconductor packaging and bonding form polymer material under heat and pressure in a mold tool. Injection molding equipment of this class is used to encapsulate, overmold, or structurally form package-related parts around devices or inserts.
How it works
General reference — not yet source-verifiedInjection molding machines of this class plasticize molding compound or resin, inject the material into a closed mold, and hold pressure while the material fills and sets. The mold then opens so the formed part can be removed and the cycle repeated. Double-shot configurations generally use sequential shots to place more than one molded material or stage into a single part build sequence.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor packaging flows, injection molding equipment is used after device fabrication and singulation-related preparation when a package body, encapsulant form, or overmold structure must be created. Downstream steps can include cure, trim and form, marking, inspection, and final test depending on the package design.
Applications
General reference — not yet source-verifiedInjection molding equipment in this category is applied to package encapsulation, insert molding, connector and carrier body formation, and other transfer of thermoplastic or thermoset material into a defined package shape. Packaging lines use such tools where repeatable mold cavity filling and part geometry are required around semiconductor devices, leadframes, substrates, or other inserts.
What do the numbers mean?
Configuration & options6
- Double Shot[3]
Vintage & configurations
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the SE 130 DU CI Injection are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SE 130 DU CI Injection are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the SE 130 DU CI Injection are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SE 130 DU CI Injection are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SE 130 DU CI Injection is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SE 130 DU CI Injection are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Equipment inventory listing
Last updated Oct 15, 2026.
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