Sumitomo
SE 50 D Injection
The Sumitomo SE 50 D Injection is an injection molding machine. The Sumitomo SE 50 D Injection is categorized under Packaging & Bonding. The Sumitomo SE 50 D Injection is specified with 3 Phase power, AC200V at 50/60 Hz, AC220V at 60 Hz, inverter 16.8A, and heater 6.6KW.[1][2]
What it is
The Sumitomo SE 50 D Injection is an injection molding machine. The SE 50 D Injection is placed in the Packaging & Bonding category.[2]
How it works
Where it fits in the process flow
General reference — not yet source-verifiedInjection molding equipment is used in the assembly and packaging portion of semiconductor manufacturing rather than in front-end wafer fabrication. Injection molding tools are typically positioned after die attach and wire interconnection work and before downstream trim, form, mark, inspection, and final package separation operations.
Applications
General reference — not yet source-verifiedInjection molding in semiconductor packaging is used to form protective encapsulation around semiconductor devices and related electronic assemblies. The process supports package formation where a molded body is needed to shield the die and internal connections from handling and the external environment.
What do the numbers mean?
Power & electrical6
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the SE 50 D Injection are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SE 50 D Injection are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SE 50 D Injection are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SE 50 D Injection are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SE 50 D Injection are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SE 50 D Injection is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]Inventory photo
Last updated Oct 21, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
