SUSS MicroTec

C4NP

Research Quality: 40% complete

What is it?

The C4NP tools page describes a production-capable C4NP flow with mold preparation, solder transfer, and mold storage. It states that the tools are for full production capability of 150 wafer starts per day, and that a semiautomatic version is also available for process development work.

What can it run?

Process applications and technology nodes documented for this tool.

C4NP
wafer bumping
solder transfer
mold preparation
mold inspection

What do the numbers mean?

Wafer handling2

Production capability: 150 wafer starts per day^[1]
Solder Transfer Tool (STT): A full production system has multiple transfer stations in one machine^[1]

Configuration & options3

Semiautomatic version: Available; especially suited to process development work^[1]
Mold Fill Tool (MFT): Molten solder is filled into cavities of an empty mold^[1]
Mold Inspect Tool (MIT): Uses a Cognex-based system to detect defects such as missing bumps^[1]

Interested in this tool?

Embed spec card

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the C4NP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the C4NP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the C4NP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the C4NP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the C4NP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the C4NP is not on record.
Answerable by: an OEM datasheet or a fab qualification report