XBS300

The SUSS MicroTec XBS300 is a wafer bonding system designed for temporary bonding applications in semiconductor packaging and advanced packaging. Temporary bonding systems such as the XBS300 mount a device wafer to a rigid carrier wafer, enabling the device wafer to be thinned, processed, and handled in subsequent back-end steps without warping or breaking.

Temporary bonders like the XBS300 apply a bonding adhesive — typically a polymeric material — between the device wafer and a carrier wafer. The system aligns the two wafers, applies controlled pressure and temperature to cure the adhesive, and forms a temporary bond that is strong enough to withstand grinding, etching, and lithography steps on the device wafer backside. After processing, a debonding step (often thermal, mechanical, or laser-assisted) releases the thinned device wafer from the carrier.

The XBS300 model is a stand-alone bonder that supports wafer-level temporary bonding. The system integrates pre-alignment, bond chamber, and process control to achieve uniform bond lines and low defectivity across the wafer pair.

Temporary bonding is a critical step in the fabrication of three-dimensional integrated circuits, through-silicon via (TSV) stacks, and other advanced packaging architectures where device wafers must be thinned to tens of micrometers. The XBS300 sits in the process flow after front-end wafer completion and before wafer thinning. After temporary bonding, the wafer stack moves to grinding, dry etching, or chemical-mechanical planarization (CMP) steps that reduce the device wafer thickness. Following backside processing — such as TSV reveal, redistribution layer formation, or bumping — the device wafer is debonded from the carrier for singulation or further assembly.

The XBS300 is used for temporary bonding in applications that require extreme wafer thinning, including power devices, RF devices, memory stacks, and logic-on-logic integration. The system supports a range of adhesive materials designed for compatibility with subsequent process chemistries and thermal budgets. Temporary bonding with the XBS300 enables handling of ultrathin wafers in production environments.