Takatori
GLP 200 CT Wafer Backside
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedA wafer backside grinder is a precision grinding machine used to reduce the thickness of processed wafers from the rear side. In this class of equipment, the wafer is held on a support system while a rotating abrasive wheel removes material in a controlled way to prepare the wafer for later packaging or singulation steps.
How it works
General reference — not yet source-verifiedBackside grinding machines use a rotating grinding wheel, precision wafer handling, and controlled motion between the wheel and wafer surface to remove material from the wafer rear side. The process is engineered to limit thickness variation and maintain mechanical integrity while thinning the substrate.
Where it fits in the process flow
General reference — not yet source-verifiedBackside grinding sits in the wafer thinning and preparation portion of the semiconductor flow, after front-side device processing and before downstream separation, assembly, or packaging steps. It is used when the wafer must be thinned to meet later assembly or form-factor needs.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
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Not publicly documented
Field notes
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Frequently asked questions
What is the Takatori GLP 200 CT?
It is a Takatori wafer backside grinder.[1]
Not publicly documented
The following facts about the GLP 200 CT Wafer Backside are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the GLP 200 CT Wafer Backside are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the GLP 200 CT Wafer Backside are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the GLP 200 CT Wafer Backside are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the GLP 200 CT Wafer Backside are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the GLP 200 CT Wafer Backside are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Jul 30, 2026.
