Takatori

The Takatori MWS 610 is a wire saw for dicing and grinding.

The Takatori MWS 610 SD is a wire saw for dicing applications, introduced in 2017.

The Takatori ATM 1100 E is a film laminator/taping machine that handles 8-inch wafers.

The Takatori ATRM 2100 D is a detaper designed for 6-inch wafers.

Takatori MWS-612SD is a multi wire saw in Takatori's advanced materials manufacturing equipment lineup for slicing hard brittle materials.

The Takatori MWS-SiC6 is a multi wire saw for slicing hard brittle materials.

The Takatori MWS 610 SN is a wire saw in the Dicing & Grinding category.

The Takatori ATRM 2100 Detaper is a wafer detaper also described as an automatic detaper and tape remover.

Takatori WSD-K2 is a single wire saw developed for outstanding performance comparable to a multi wire saw.

Takatori MWS-44SN is a multi wire saw in Takatori’s advanced materials manufacturing equipment line-up.

The Takatori MWS-612DN is a multi wire saw for slicing hard brittle materials.

The Takatori MWS 612 is a wire saw in the Dicing & Grinding category. The Takatori MWS 612 has a maximum workpiece shape of φ150mm x 300mm.

The Takatori GLP-200W is a grinder with a high rigidity structure designed for thickness accuracy.

The Takatori MWS 610 SD is a wire cutter.

Takatori ATM 1100 E is a Takatori equipment model identified by model designation ATM 1100 E.

The Takatori MWS 612 DD Multi is a wire saw for 6-inch wafers.

The Takatori WSD K 3 is a wire saw described as capable of handling SiC, sapphire, quartz crystal and optical materials, and compound semiconductors.

The Takatori ATM 8100 S is an automatic wafer mounter for mounting wafers to dicing frames before dicing.

The Takatori MWS-23N is a multi wire saw model listed in Takatori's Advanced Materials Manufacturing Equipment lineup for slicing hard brittle materials.

The Takatori MWS-812SD is a multi wire saw for slicing hard brittle materials. The Takatori MWS-812SD is part of Takatori's MWS line for processing quality in slicing and grinding.

The Takatori MWS-SiC12F is a wire saw for SiC that slices up to 14 inches and uses a highly rigid structure for high-precision slicing.

The Takatori MWS-34SN is a multi wire saw for slicing hard brittle materials with variable processing conditions.

The Takatori GLP-150 is a grinder with a high rigidity structure designed for thickness accuracy and adaptability to various grindstones, suitable for automation.

The Takatori MWS-45SN is a multi wire saw for slicing, cutting, and lapping hard brittle materials. The Takatori MWS-45SN features a rocking motion-slicing mechanism, direct-drive wire control, microcomputer-controlled cutting conditions, automatic wire winding, and diamond slurry compatibility.