Temescal

8-pocket

Deposition 4-inch wafers Temescal 8-pocket family

Research Quality: 30% complete

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Temescal8-pocket

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Wafer size

4-inch wafers

Power

Temescal 10kV power supply^[1]

Vacuum

~ 5e-7 ultimate base pressure^[1]

What is it?

The source text describes an electron-beam evaporation system with an 8-pocket e-beam source and notes its use for vacuum deposition. It is listed with Temescal 10kV power supply, Temescal e-beam sweep control, and an Inficon IC/5 programmable crystal thickness monitoring system, and it supports multiple wafer configurations including 4-inch wafers.

What can it run?

Process applications and technology nodes documented for this tool.

n-type ohmic contact metalization to compound semiconductors
Schottky contacts to semiconductors
bond pads
general metalizations

What do the numbers mean?

Power & electrical1

Power supply: Temescal 10kV power supply^[1]

Vacuum & pumping1

Base pressure: ~ 5e-7 ultimate base pressure^[1]

Wafer handling5

Wafer capacity: Up to 9 4-inch wafers in lift-off configuration^[1]
Wafer capacity: Up to 18 4-inch wafers in sidewall coverage configuration^[1]
Sample size: Pieces or 9x 4-inch wafers for lift-off (normal incidence)^[1]
Sample size: 24x 4-inch wafers for sidewall coverage (planetary)^[1]
Sample size: 4x 6-inch wafers for normal incidence^[1]

Control & software1

Deposition controller: Inficon IC/5 programmable crystal thickness monitoring system^[1]

Configuration & options2

E-beam source: Temescal 8-pocket series, 260 e-beam sources^[1]
Maximum deposition thickness: 1.0 microns per run^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Power supplyTemescal 10kV power supply^[1]
Base pressure~ 5e-7 ultimate base pressure^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 8-pocket are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8-pocket are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 8-pocket are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 8-pocket are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8-pocket are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 8-pocket is not on record.
Answerable by: an OEM datasheet or a fab qualification report