Waferpedia

West Bond

4546E

Packaging & BondingWest Bond 4546E family
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West Bond4546E
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Power

5 W, 63 kHz[1]

Optics

look down camera and screen[1]

What is it?

The West-Bond 4546E is described as a semi-automatic wedge bond tool with microprocessor controllable motion in the Z and Y axes. It uses ultrasonic energy to bond wire leads between wafer dies and contact pads of electronic packages, and is typically configured for 1 mil (25 μm) Al wire in wedge bonding configuration.

What can it run?

Process applications and technology nodes documented for this tool.

  • making electrical contacts between semiconductor dies and packages

What do the numbers mean?

Power & electrical1

Transducer
5 W, 63 kHz[1]
Accurate?

Optics & imaging1

Bond placement aid
look down camera and screen[1]
Accurate?

Control & software2

Motion control
microprocessor controllable motion in Z and Y axes[1]
Accurate?
Bonding control
programmable bonding steps for repeatable wire profile control[1]
Accurate?

Configuration & options7

Vendor
West-Bond Inc.[1]
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Model
4546E[1]
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Tool type
semi-automatic wedge bond tool[1]
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Bonding method
uses ultrasonic energy[1]
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Typical wire configuration
1 mil (25 μm) Al wire (wedge bonding configuration)[1]
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Convertible bonding modes
45° wedge and 90° (deep access) wedge bonding[1]
Accurate?
Wire compatibility
Al and Au wires from 0.7 mil to 2 mil in diameter for room temperature thermosonic bonding[1]
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Interested in this tool?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Transducer5 W, 63 kHz[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What type of machine is the West Bond 4546E?

It is a semi-automatic wedge wire bonder.[1]

What is the West Bond 4546E used for?

It is used for making electrical contacts between semiconductor dies and packages.[1]

What bonding method does the West Bond 4546E use?

It uses ultrasonic energy to bond wire leads between wafer dies and contact pads of electronic packages.[1]

Not publicly documented

The following facts about the 4546E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4546E are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 4546E are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 4546E are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 4546E are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 4546E is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]uwaterloo.cauwaterloo.cauwaterloo.ca
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Last updated Jul 29, 2026.

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