West Bond

The West Bond 10490 is a convertible bonder that can be configured for wedge or ball bonding.

The WestBond 7476 D 79 is a manual wedge-wedge wire bonding system used to create electrical interconnections between microfabricated devices, semiconductor chips, and external packages.

The WestBond 2426 B is a semi-automatic wire bonder.

The West Bond wire bonder listed is a semi-automatic wedge bond tool used for making electrical contacts between semiconductor dies and packages.

The West Bond 7700 E 79 is a bonder for gold wires ranging from 0.0007" to 0.002", with a heated work holder and digital control.

The West Bond 353637 E 90 is a wire bonder with a 5.375" × 9.5" bonding area and 2400B Series software.

The WestBond 7700 D 79 is a wire bonder.

The WestBond 7476 E 79 Wedge is a wedge wire bonder with deep access and several specified operating features.

WestBond 242627 B 73 B is a semi-automatic die bonder with a wire feeder, heated collet, and new monitor.

The West Bond 4 KE is a wire bonder with a bond force range of 10–150 grams.

The West Bond 4 KEX is a wire bonder with a 20" × 20" work platform, a 6" × 8" heated work holder, conventional 45° wire feed, and a bond force range of 10–150 grams.

The West Bond 7476E is a wedge-wedge ultrasonic wire bonder used for electrical interconnects on semiconductor, hybrid, microwave, integrated circuit package, and integrated circuit die applications.

The West Bond 747677E is a wire bonder used for wire bonding to interconnect wire leads to semiconductor, hybrid, or microwave devices.

WestBond 7200 44 A 45 C is a Pick and Place Epoxy Die Bonder.

The West-Bond 7476E is a manual wirebonding tool used for making electrical contacts between semiconductor dies and packages.

The West-Bond 747677E is a manual wire bonder configured for wedge and ball bonding.

The Westbond 70PTC is a wire pull tester used for destructive and non-destructive pull testing of completed wirebonds.

The West Bond 7KE is a convertible manual wire bonder for interconnecting gold wire leads to semiconductor devices.

The West-Bond 4546E is a semi-automatic wedge wire bonder used to make electrical contacts between semiconductor dies and packages.