West Bond

The West Bond 7372E is a dual-head die bonder in the E-Series line.

The West Bond K 1200 P is a semiconductor manufacturing equipment unit cataloged under asset number 136359.

The West Bond 7700E Series is a manual ball-wedge wire bonder designed to interconnect wire leads to semiconductor, hybrid, or microwave devices.

The West Bond Model 7700E Series is a manual thermosonic ball-wedge wire bonder designed to interconnect wire leads to semiconductor, hybrid, or microwave devices.

The West Bond 5700 is a wire bonder in the West-Bond equipment line.

The West Bond 7200 is a Pick & Place Epoxy Die Bonder series, with listed variants including the 7200A, 7200AA, 7200AD, 7200Head, and 7200AR.

The West Bond 7600B is a manual deep-access wedge wire bonder.

The West Bond 7400B is a manual wedge wire bonder.

The West Bond 7600C is a deep access 90° feed wedge wire bonder.

The West Bond 7614 is a wire bonder in the Packaging & Bonding category.

The West Bond 7443A is listed as a wire bonder.

The West Bond 3436E-90 is a large area wire bonder.

The West Bond 10490 is a convertible bonder that can be configured for wedge or ball bonding.

The West Bond 7KF Series is a manual wire bonder line for microelectronics packaging, and West Bond says it has designed and manufactured its wire bonding and die attach equipment since 1966.

The West Bond 7327A is a thermocompression wedge manual wire bonder.

West-Bond 7400A is a manual wedge wire bonder line that includes vertical-feed and ultrasonic feed configurations.

The West Bond 7700B is a ball bonder.

The West Bond 4 KE is a wire bonder with a bond force range of 10–150 grams.

The West Bond 7700 E 79 is a bonder for gold wires ranging from 0.0007" to 0.002", with a heated work holder and digital control.

The WestBond 7476 D 79 is a manual wedge-wedge wire bonding system used to create electrical interconnections between microfabricated devices, semiconductor chips, and external packages.

The West Bond 7000 Series is a bonder categorized under Packaging & Bonding.

WestBond 7200 44 A 45 C is a Pick and Place Epoxy Die Bonder.

The West Bond 7374 B Pick and Place Epoxy is a packaging and bonding tool.

The West Bond 1200 D Temperature Controller is a temperature controller categorized under Packaging & Bonding.

West Bond 4KE Series is a semi-automatic wire bonder line for microelectronics packaging that uses microprocessor-controlled motor drives for the Y and Z axes.

The WestBond 7700 D 79 is a wire bonder.

The West Bond 7367E is a manual dual-head die bonder in the E-Series. The West Bond 7367E uses a gantry construction, orthogonal motions, and individual axis brakes.

The West Bond 3700E is a wire bonder used in semiconductor packaging and bonding.

The West Bond 4500 is a wire bonder listed among West-Bond wire bonder models.

The West Bond 7416 is a thermocompression wedge bonder. The West Bond 7416 includes a heated tool, a heated workholder, and stereo zoom optics.

The West Bond 7434 is a wire bonder listed among West-Bond wire bonder models.

The West Bond 7443 is a wire bonder used in semiconductor packaging.

The West Bond 7476 is a wire bonder listed among West-Bond wire bonder models. The West Bond 7476 is identified in a source entry as a 7400B / 7600B 90° vertical feed deep access wedge bonder.

The West Bond 7700 is a wire bonder line in the Packaging & Bonding category.

The West Bond 7476B is a 90° vertical feed deep access wedge wire bonder.

The West Bond 7614A-32-45D is a wire bonder.

The West Bond 7700A is an ultrasonic ball and wedge wire bonder. The West Bond 7700A is also listed as a manual ball bonder and a manual thermosonic gold ball wire bonder.

The West Bond 7730E is a high frequency manual gold ball wire bonder.

The West Bond 747677E is a wire bonder used for wire bonding to interconnect wire leads to semiconductor, hybrid, or microwave devices.

The West-Bond 4546E is a semi-automatic wedge wire bonder used to make electrical contacts between semiconductor dies and packages.

The West-Bond 7200AD is a Pick & Place Epoxy Die Bonder.

The West-Bond 7700C is a thermosonic ball-wedge wire bonder.

The West Bond 2400 B is a wire bonder categorized under Packaging & Bonding.

The West Bond 7200 CR 79 C is a die bonder for semiconductor packaging and bonding.

The West Bond 7400A66 A is a wire bonder in the Packaging & Bonding category.

The West-Bond 7476E is a manual wirebonding tool used for making electrical contacts between semiconductor dies and packages.

The West Bond 7374E is a manual dual-head die bonder in the E-Series line.

The West Bond 7400IW is a wire bonder listed as a bonder with microscope.

The West Bond 7372 B is a die bonder manufactured by West Bond.

The West Bond 747677B is a convertible wire bonder with a gold ball bond head.

The West Bond 7730 is a wire bonder line item named in a product page that lists West Bond wire bonder models.

The West Bond 7200AA is a Pick & Place Epoxy Die Bonder.

The West Bond 7434-15A-32 is a wire bonder.

The West Bond 7200Head is a pick and place epoxy die bonder.

The West Bond 353637 E 90 is a wire bonder with a 5.375" × 9.5" bonding area and 2400B Series software.