Waferpedia

West Bond

7476 D 79

Packaging & BondingWest Bond 7476 family
Research Quality: 40% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

7476 D 79 — Inventory photo
Fig. 017476 D 79Inventory photo[1]

How it works

The West Bond 7476 D 79 employs ultrasonic energy at approximately 63 kilohertz for bonding. Aluminum wire is bonded at room temperature using only ultrasonic energy. Gold wire bonding requires additional workpiece heating through a heated stage, a process known as thermosonic bonding. The system provides adjustable bonding force and ultrasonic energy for process optimization. A manual X-Y-Z micromanipulator is used for precise positioning of the bonding tool.[2]

What do the numbers mean?

Power & electrical1

Ultrasonic frequency
approximately 63 kHz[2]
Accurate?

Configuration & options10

Olympus SZ 51-60 Microscope[1]
Accurate?
Bonding technique
manual wedge-wedge wire bonding[2]
Accurate?
Minimum bond pad size
50 µm[2]
Accurate?
Maximum bond sites before wire parting
21[2]
Accurate?
Wire diameter range
0.0007–0.002 inches (17.8–50.8 µm)[2]
Accurate?
Supported wire materials
aluminum and gold[2]
Accurate?
Current wire configuration
0.00125-inch (31.75 µm) aluminum wire[2]
Accurate?
Aluminum wire bonding temperature
room temperature[2]
Accurate?
Gold wire bonding method
heated-stage thermosonic bonding[2]
Accurate?
Microscope
Olympus SZ 51-60[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Ultrasonic frequencyapproximately 63 kHz[2]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

Can the system bond aluminum wire at room temperature?

Yes, aluminum wire is bonded at room temperature using only ultrasonic energy.[2]

Not publicly documented

The following facts about the 7476 D 79 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7476 D 79 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 7476 D 79 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 7476 D 79 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 7476 D 79 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 7476 D 79 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]tmi.utexas.edutmi.utexas.edutmi.utexas.edu
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Last updated Sep 4, 2026.

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