West Bond
7476 D 79
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The West Bond 7476 D 79 is a manual wedge-wedge wire bonding system. The West Bond 7476 D 79 uses ultrasonic energy at approximately 63 kHz. The West Bond 7476 D 79 is configured for 0.00125-inch aluminum wire.[1][2]
What it is
The West Bond 7476 D 79 is a manual wedge-wedge wire bonding system. The West Bond 7476 D 79 is used to create electrical interconnections between microfabricated devices, semiconductor chips, and external packages. The West Bond 7476 D 79 is suitable for electronic and optoelectronic testing, nano and micro fabrication, bonding devices to packages, and bonding devices to electrical test fixtures. The West Bond 7476 D 79 can be configured with an Olympus SZ 51-60 microscope.[1][3][2]
How it works
The West Bond 7476 D 79 uses ultrasonic energy at approximately 63 kHz for bonding. The West Bond 7476 D 79 bonds aluminum wire at room temperature using ultrasonic energy. The West Bond 7476 D 79 performs gold wire bonding with additional workpiece heating through a heated stage for thermosonic bonding. The West Bond 7476 D 79 provides adjustable bonding force and ultrasonic energy for process optimization. The West Bond 7476 D 79 uses a manual X-Y-Z micromanipulator for precise positioning of the bonding tool. The West Bond 7476 D 79 uses a binocular microscope for direct visualization and alignment of bond locations.[1][2]
Where it fits in the process flow
The West Bond 7476 D 79 fits into packaging and post-fabrication interconnect work. The West Bond 7476 D 79 is used to connect microfabricated devices and semiconductor chips to external packages and electrical test fixtures. The West Bond 7476 D 79 therefore supports transition from fabricated device structures to package-level or test-level electrical access.[1]
Applications
General reference — not yet source-verifiedManual wedge bonders are used where engineers need direct access to individual bond sites, flexible setup, and visual control over the bonding operation. Typical uses include chip-to-package interconnects, temporary or semi-permanent connections for characterization, and assembly of research or specialty devices.
What do the numbers mean?
Power & electrical1
Configuration & options14
- Olympus SZ 51-60 Microscope[3]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Ultrasonic frequencyapproximately 63 kHz[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What bonding method does the West Bond 7476 D 79 use?
The West Bond 7476 D 79 is a manual wedge-wedge wire bonding system.[1][2]
Which wire materials can the West Bond 7476 D 79 bond?
The West Bond 7476 D 79 accommodates aluminum and gold wire.[1][2]
What wire diameter range does the West Bond 7476 D 79 support?
The West Bond 7476 D 79 supports wire diameters from 0.0007 to 0.002 inches, or 17.8 to 50.8 µm.[1][2]
Not publicly documented
The following facts about the 7476 D 79 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7476 D 79 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7476 D 79 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7476 D 79 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7476 D 79 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7476 D 79 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]tmi.utexas.edu — tmi.utexas.edutmi.utexas.edu
- [2]7476 D 79 — West Bond | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]Inventory photo
Last updated Oct 20, 2026.
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