West Bond

7476E

Packaging & Bonding West Bond 7476E family

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7476E — uwaterloo.ca — Fig. 017476Euwaterloo.ca^[1]

Plate 017476E
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Plate 03Westbond 7476E Convertible wire bonder demo video
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What is it?

The West Bond 7476E is described as a manual, two-way convertible wedge-to-wedge ultrasonic wire bonder. Sources state that it is used for making electrical interconnects between semiconductor dies and packages, and for interconnecting wire leads to semiconductor, hybrid, or microwave devices. Reported capabilities include wedge bonding at 45° and 90° deep access, with compatibility for aluminum and gold wires and ribbons within stated size ranges.

What can it run?

Process applications and technology nodes documented for this tool.

Making electrical contacts between semiconductor dies and packages
Interconnecting wire leads to semiconductor devices
Interconnecting wire leads to hybrid devices
Interconnecting wire leads to microwave devices
Making electrical interconnects between integrated circuit packages and integrated circuit dies

What do the numbers mean?

Power & electrical2

Purpose: Used for making electrical contacts between semiconductor dies and packages^[1]
Ultrasonic transducer: 4 W, 63 kHz^[1]

Control & software1

Manual control: Manual control via 8:1 reduction ratio micromanipulator arm^[1]

Configuration & options11

Manufacturer: West Bond^[3]
Model: 7476E^[3]
Instrument type: West Bond Wedge-Wedge Gold Wire Bonder^[3]
Description: Two-way convertible wedge-to-wedge ultrasonic bonder^[2]
Bonding technique: Wedge-wedge technique using ultrasonic energy^[2]
Bonding orientations stated: 45° wedge bonding; 90° wedge bonding (deep access)^[1]
Compatible wire materials stated: Aluminum or gold wires^[2]
Wire diameter range stated: 0.0007 in. to 0.002 in.^[2]
Ribbon diameter range stated: 0.001 in. to 0.010 in.^[2]
Default wire: 0.001 in. diameter aluminum wire^[2]
Sample holder size: Up to around 30 mm x 30 mm^[2]

Interested in this tool?

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

PurposeUsed for making electrical contacts between semiconductor dies and packages^[1]
Ultrasonic transducer4 W, 63 kHz^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 7476E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7476E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7476E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7476E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7476E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7476E is not on record.
Answerable by: an OEM datasheet or a fab qualification report