West Bond

wirebond-R1

Packaging & Bonding West Bond wirebond-R1 family

Research Quality: 40% complete

wirebond-R1 — uwaterloo.ca — Fig. 01wirebond-R1uwaterloo.ca^[1]

What is it?

The listed equipment is a West-Bond Inc. model 7476E manual wirebonder. The source describes it as a manual wirebonding tool for making electrical interconnects between integrated circuit packages and integrated circuit dies, with 45° wedge and 90° wedge (deep access) configurations and compatibility with Au or Al wires.

What can it run?

Process applications and technology nodes documented for this tool.

Making electrical contacts between semiconductor dies and packages
Making electrical interconnects between integrated circuit packages and integrated circuit dies

What do the numbers mean?

Power & electrical3

Purpose: Used for making electrical contacts between semiconductor dies and packages^[2]
Equipment description: Manual wirebonding tool designed to make electrical interconnects between integrated circuit packages and integrated circuit dies^[2]
Ultrasonic transducer: 4 W 63 kHz^[2]

Control & software1

Manual control: Available via 8:1 reduction ratio micromanipulator arm^[2]

Configuration & options4

Vendor: West-Bond Inc.^[2]
Model: 7476E^[2]
Bonding configurations: 45° wedge bonding and 90° wedge bonding (deep access)^[2]
Wire compatibility: Optimized for Au or Al wires with a 25 μm (0.001") diameter; compatible with Al and Au wires from 0.7 mil to 2 mil in diameter for room temperature thermosonic bonding^[2]

Interested in this tool?

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

PurposeUsed for making electrical contacts between semiconductor dies and packages^[2]
Equipment descriptionManual wirebonding tool designed to make electrical interconnects between integrated circuit packages and integrated circuit dies^[2]
Ultrasonic transducer4 W 63 kHz^[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the wirebond-R1 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the wirebond-R1 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the wirebond-R1 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the wirebond-R1 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the wirebond-R1 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the wirebond-R1 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources

[1]uwaterloo.ca — uwaterloo.cauwaterloo.ca
[2]uwaterloo.ca — uwaterloo.cauwaterloo.ca
[3]RAC1 wirebonder: manual [WESTBOND-wirebond-R1] | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca