ADT
8020 Auto Twin Dicing alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
Disco
DAD 3350 Automatic Dicing
Dicing & Grinding
The Disco DAD 3350 is an automatic dicing saw.
Disco
DAD 340 Wafer
Dicing & Grinding
The Disco DAD 340 Wafer is a wafer dicing saw used in semiconductor back-end processing.
Disco
DFD 6340 Automatic Dicing
Dicing & Grinding
The Disco DFD 6340 is an automatic dicing saw.
Disco
DFD 6341
Dicing & Grinding
The Disco DFD 6341 is a dicer identified with 3-phase, 380-415 V, 3 wire + ground, 50/60 Hz power requirements.
Disco
DFD 6341 Automatic Dicing
Dicing & Grinding
The Disco DFD 6341 Automatic Dicing is an automatic dicing saw, a machine used in semiconductor and precision optics manufacturing to singulate individual devices from a substrate.
Meyer Burger
OC 266 Wafer
Dicing & Grinding
The Meyer Burger OC 266 Wafer is a wafer saw in the Dicing & Grinding category.
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