EV Group
510 Wafer alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
EV Group
501 Wafer
Manual wafer load substrate bonder
Packaging & Bonding
The EVG 501 Wafer Bonder is a manual wafer-load substrate bonder for 2-inch to 6-inch wafers.
EV Group
520
Manual wafer load substrate bonder
Packaging & Bonding
The EVG 520 is a manual wafer load substrate bonder with fusion, thermal compression, and anodic bonding capability.
EV Group
520 IS Wafer
Manual wafer load substrate bonder
Packaging & Bonding
The EVG 520 IS Wafer is a manual wafer load substrate bonder with capabilities for fusion compression, thermal compression, and optional anodic bonding.
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
Applied Materials
0041-26723 Bonded Assembly
Packaging & Bonding
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
Logitech
1 WBS 1 Wafer Substrate
Packaging & Bonding
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
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