Waferpedia

EV Group

520 IS Wafer

520 IS Wafer — Inventory photo
Fig. 01520 IS WaferInventory photo[1]
  • Plate 01EVG 520 Wafer Bonder (ID# 4313)

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  • Plate 02EVG 520IS Semi-Automatic Wafer Bonder (ID# 3815)

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Wafer size

Manual wafer load substrate bonder

Vacuum

High-vacuum capable bond chamber[1]

Performance

± 1,5 %[1]

What is it?

The EVG 520 IS Wafer is a manual wafer load substrate bonder with capabilities for fusion compression, thermal compression, and optional anodic bonding.

What do the numbers mean?

Vacuum & pumping3

High-vacuum capable bond chamber[1]
Accurate?
Turbo pump & controller[1]
Accurate?
Roughing pump[1]
Accurate?

Wafer handling1

Wafer size
Manual wafer load substrate bonder[1]
Accurate?

Performance1

Temperature uniformity
± 1,5 %[1]
Accurate?

Control & software2

Windows based control software and operation interface[1]
Accurate?
System computer, monitor, and keyboard[1]
Accurate?

Configuration & options10

Refurbished[3]
Accurate?
Capable of fusion compression bonding[1]
Accurate?
Capable of thermal compression bonding[1]
Accurate?
Capable of anodic bonding (optional)[1]
Accurate?
Ideal for R&D and pilot production applications[1]
Accurate?
Auto opening of bond tool cover[1]
Accurate?
Max Bond Force
60 kN[1]
Accurate?
Top side heater
550°C max. in 1°C steps[1]
Accurate?
Bottom side heater
550°C max. in 1°C steps[1]
Accurate?
Chiller[1]
Accurate?
Interested in this tool?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationHigh-vacuum capable bond chamber[1]
  • ConfigurationTurbo pump & controller[1]
  • ConfigurationRoughing pump[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 520 IS Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 520 IS Wafer are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 520 IS Wafer are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 520 IS Wafer are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 520 IS Wafer are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 520 IS Wafer is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]inventory listing
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Last updated Jul 29, 2026.

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