Waferpedia

EV Group

501 Wafer

501 Wafer — Inventory photo
Fig. 01501 WaferInventory photo[1]
  • Plate 01EVG 501 Wafer Bonder (ID# 4726)

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Wafer size

Manual wafer load substrate bonder

Vacuum

High-vacuum capable bond chamber[2]

Performance

± 1,5 %[2]

What is it?

The EVG 501 Wafer Bonder is a manual wafer-load substrate bonder for 2-inch to 6-inch wafers.

What do the numbers mean?

Vacuum & pumping3

High-vacuum capable bond chamber[2]
Accurate?
Turbo pump and controller[2]
Accurate?
Roughing pump[2]
Accurate?

Wafer handling2

Wafer size
Manual wafer load substrate bonder[2]
Accurate?
Wafer size
up to 6”/150mm[2]
Accurate?

Performance1

Temperature uniformity
± 1,5 %[2]
Accurate?

Control & software2

Windows based control software and operation interface[2]
Accurate?
System computer, monitor, and keyboard[2]
Accurate?

Configuration & options7

Capable of fusion compression bonding[2]
Accurate?
Capable of thermal compression bonding[2]
Accurate?
Capable of anodic bonding[2]
Accurate?
Max Bond Force
7 kN[2]
Accurate?
Top side heater
550°C max. in 1°C steps[2]
Accurate?
Bottom side heater
550°C max. in 1°C steps[2]
Accurate?
Load/unload tool[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationHigh-vacuum capable bond chamber[2]
  • ConfigurationTurbo pump and controller[2]
  • ConfigurationRoughing pump[2]

Where are the manuals?

Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What bonding modes does the EVG 501 Wafer Bonder support?

It supports fusion compression bonding, thermal compression bonding, and anodic bonding.[2]

What are the heater limits?

The top-side heater and bottom-side heater are each stated to reach 550°C in 1°C steps.[2]

Not publicly documented

The following facts about the 501 Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 501 Wafer are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 501 Wafer are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 501 Wafer are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 501 Wafer are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 501 Wafer is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]inventory listing
  3. [3]EVG 501 Brochureaggiefab.tamu.eduaggiefab.tamu.edu
  4. [4]EVG|Wafer Bonding Systemeevgroup.com (Mar 12, 2017)web.archive.org
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Last updated Jul 29, 2026.

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