Waferpedia

EV Group

520

520 — Inventory photo
Fig. 01520Inventory photo[1]

Wafer size

Manual wafer load substrate bonder

Power

50 / 60 Hz[1]

Vacuum

High-vacuum capable bond chamber[1]

Performance

± 1,5 %[1]

What is it?

The EVG 520 is a manual wafer load substrate bonder with fusion, thermal compression, and anodic bonding capability.

What do the numbers mean?

Power & electrical3

50 / 60 Hz[1]
Accurate?
120 / 208 V[1]
Accurate?
Phase
3 Phase[1]
Accurate?

Vacuum & pumping4

High-vacuum capable bond chamber[1]
Accurate?
Vacuum Chuck
6"/150mm diameter chuck[1]
Accurate?
Turbo pump and controller[1]
Accurate?
Roughing pump[1]
Accurate?

Wafer handling2

Wafer size
Manual wafer load substrate bonder[1]
Accurate?
Wafer Size
up to 150 mm capable[1]
Accurate?

Performance1

Temperature uniformity
± 1,5 %[1]
Accurate?

Control & software1

Windows based control software and operation interface[1]
Accurate?

Configuration & options9

Refurbished[1]
Accurate?
Capable of fusion & thermal compression bonding[1]
Accurate?
Capable of anodic bonding[1]
Accurate?
Auto opening of bond tool cover[1]
Accurate?
Max Bond Force
7 kN[1]
Accurate?
Top Side Heater
550°C max. in 1°C steps[1]
Accurate?
Bottom Side Heater
550°C max. in 1°C steps[1]
Accurate?
Thermoflex 1400 Chiller (or equivalent)[1]
Accurate?
Load / unload tool[1]
Accurate?
Interested in this tool?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Configuration50 / 60 Hz[1]
  • Configuration120 / 208 V[1]
  • Phase3 Phase[1]
  • ConfigurationHigh-vacuum capable bond chamber[1]
  • Vacuum Chuck6"/150mm diameter chuck[1]
  • ConfigurationTurbo pump and controller[1]
  • ConfigurationRoughing pump[1]

Parts & consumables

Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.

  • EVG 520 IS Manual Wafer Load Substrate BonderIn Productionsource[2]
  • EVG 520 Manual Wafer Load Substrate BonderIn Productionsource[3]
  • EVG 520 Manual Wafer Load Substrate BonderIn Productionsource[4]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 520 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 520 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 520 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 520 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 520 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 520 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing
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Last updated Jul 29, 2026.

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