Waferpedia

Tool family

Applied Materials Producer

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Models in this family

  1. Applied Materials Producer is a plasma CVD (chemical vapor deposition) system stated to be available for 8-inch wafers.

    Cited variants

    DesignationGenerationVintageChangesSource
    Producer Etcher eXT Poly——12-inch etcher variant for poly processingEquipment inventory listing[1]
    Producer Etcher eXT Dielectric——12-inch etcher variant for dielectric processingEquipment inventory listing[2]
  2. Producer GTproduced 2006–

    Cited variants

    DesignationGenerationVintageChangesSource
    Applied Materials Producer GT Etcher—2014Listed with Chamber A: SiCoNi and Chamber B: Frontier Etch, plus a missing-parts list.Equipment inventory listing[3]
    Applied Materials (AMAT) Producer GT APF—2009Configured as APF PECVD deposition equipment with three APF TWIN chambers.macquarie.com[4]
  3. Applied Materials Producer GT 3 RTP is a rapid thermal process system for 12-inch wafers.

  4. Applied Materials Producer GT APF is a PECVD (plasma-enhanced chemical vapor deposition) system.

  5. Applied Materials Producer GT DARC is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.

  6. The Applied Materials Producer GT HARP is a chamber used for sub-atmospheric chemical vapor deposition (SACVD) HARP (High Aspect Ratio Process) USG (undoped silicate glass) deposition on 300 mm wafers.

  7. The Applied Materials Producer GT Metal is a chemical vapor deposition tool for 12-inch wafers, configured for TiN MCVD.

  8. The Applied Materials Producer III is a chemical vapor deposition (CVD) system.

  9. Applied Materials Producer S is a PECVD (plasma-enhanced chemical vapor deposition) system for 8-inch wafers.

  10. The Applied Materials Producer SE is a 300mm wafer chemical vapor deposition (CVD) system, offered in both standard CVD and plasma-enhanced CVD (PECVD) configurations.

All entries

  1. ProducerApplied Materials

    Applied Materials Producer is a plasma CVD (chemical vapor deposition) system stated to be available for 8-inch wafers.

    CategoryDeposition
    13 specs
  2. Producer GTApplied Materials
    CategoryEtch
    31 specs
  3. Producer GT 3 RTPApplied Materials

    Applied Materials Producer GT 3 RTP is a rapid thermal process system for 12-inch wafers.

    CategoryThermal / Diffusion
    5 specs
  4. Producer GT APFApplied Materials

    Applied Materials Producer GT APF is a PECVD (plasma-enhanced chemical vapor deposition) system.

    CategoryDeposition
    8 specs
  5. Producer GT DARCApplied Materials

    Applied Materials Producer GT DARC is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.

    CategoryDeposition
    19 specs
  6. Producer GT HARPApplied Materials

    The Applied Materials Producer GT HARP is a chamber used for sub-atmospheric chemical vapor deposition (SACVD) HARP (High Aspect Ratio Process) USG (undoped silicate glass) deposition on 300 mm wafers.

    CategoryDeposition
    25 specs
  7. Producer GT MetalApplied Materials

    The Applied Materials Producer GT Metal is a chemical vapor deposition tool for 12-inch wafers, configured for TiN MCVD.

    CategoryDeposition
    5 specs
  8. Producer IIIApplied Materials

    The Applied Materials Producer III is a chemical vapor deposition (CVD) system.

    CategoryDeposition
    4 specs
  9. Producer SApplied Materials

    Applied Materials Producer S is a PECVD (plasma-enhanced chemical vapor deposition) system for 8-inch wafers.

    CategoryDeposition
    9 specs
  10. Producer SEApplied Materials

    The Applied Materials Producer SE is a 300mm wafer chemical vapor deposition (CVD) system, offered in both standard CVD and plasma-enhanced CVD (PECVD) configurations.

    CategoryDeposition
    52 specs

Sources

Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]macquarie.commacquarie.com