Waferpedia

Manufacturer

Applied Materials

1520 entries

  1. 0010-13627 High Efficiency RF MatchApplied Materials

    The Applied Materials 0010-13627 is a high efficiency RF match designed for semiconductor equipment.

  2. 0010-03485 Magnet AssyApplied Materials
  3. VIISta HC Ion ImplantApplied Materials

    The Applied Materials / Varian VIISta HC Ion Implant is an ion implantation system.

    CategoryIon Implantation
  4. Centura Ultima+ HDPApplied Materials

    The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.

    CategoryDeposition
  5. P 16 072 AncolyzerApplied Materials
  6. Mirra 3400Applied Materials

    The Applied Materials Mirra 3400 is a chemical mechanical planarization (CMP) system for 150 mm and 200 mm wafer processing.

    CategoryCMP
  7. Centura I P 1Applied Materials

    The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.

    CategoryEtch
  8. GF HW SC 140559 PartApplied Materials
  9. NanoSEM 3 D CD-SEMApplied Materials

    The Applied Materials NanoSEM 3 D CD-SEM is a critical dimension scanning electron microscope for 6-inch wafers, manufactured in 2001.

    CategoryMetrology & Inspection
  10. Centura I Phase II OxideApplied Materials

    The Applied Materials Centura I Phase II Oxide Etcher (also known as the 5200 Centura I Phase II) is an oxide etcher configured for 6-inch wafers with an upgrade path to 200 mm wafers.

    CategoryEtch
  11. 3690 02489 PartApplied Materials
  12. Centura TPCC RTP XE+Applied Materials

    The Applied Materials Centura TPCC RTP XE+ is an etcher designed for 8-inch wafers.

    CategoryEtch
  13. Producer IIIApplied Materials

    The Applied Materials Producer III is a chemical vapor deposition (CVD) system.

    CategoryDeposition
  14. Producer GT HARPApplied Materials

    The Applied Materials Producer GT HARP is a chamber used for sub-atmospheric chemical vapor deposition (SACVD) HARP (High Aspect Ratio Process) USG (undoped silicate glass) deposition on 300 mm wafers.

  15. 0720 01264 PartApplied Materials
  16. 0720 09170 PartApplied Materials

    Applied Materials 0720 09170 Part is a connector housing receptacle 4-position inline socket nylon black UV.

  17. 3691 01484 PartApplied Materials
  18. CB CP 22 101268 PartApplied Materials

    The Applied Materials CB CP 22 101268 Part is a wire high voltage strand rated 22 AWG, 20 kVDC, and 150°C with silicon insulation.

  19. 1390 01522 PartApplied Materials

    The Applied Materials 1390 01522 Part is a power cord cable rated at 10 AWG, 4 conductors, 600V, SO type.

  20. 0720 12676 PartApplied Materials
  21. 3500 00107 PartApplied Materials

    The Applied Materials 3500 00107 Part is a Nut Keps 10-24 Ext-Tooth-Wshr Sst Psvt.

  22. 3500 00036 PartApplied Materials
  23. 0020 12458 PartApplied Materials

    The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.

  24. GF HW SC 102736 PartApplied Materials
  25. 0015 20064 PartApplied Materials
  26. 0720 05979 PartApplied Materials

    The Applied Materials 0720 05979 is a spare part for semiconductor equipment, described as a Mini Hitemp Writeon Conn Yel.

  27. 0720 02053 PartApplied Materials

    The Applied Materials 0720 02053 is a connector part described as a 40-pin IDC female housing crimp connector.

  28. 1390 01233 PartApplied Materials
  29. 0720 13094 PartApplied Materials
  30. G 3 LiteApplied Materials

    The Applied Materials G 3 Lite is an inspection system.

    CategoryMetrology & Inspection
  31. 0720 08969 PartApplied Materials

    Applied Materials 0720 08969 is a part described as a contact socket for 28-24 AWG wire, gold, type DF3.

  32. 0720 07309 PartApplied Materials

    The Applied Materials 0720 07309 is a connector plug with 3 positions, rectangular shape, and 3.6mm diameter contact.

  33. 0041 27342 PartApplied Materials

    The Applied Materials 0041 27342 Part is a component described as a top plate, RF filter box, and E-chuck.

  34. CN CP 00 147893 PartApplied Materials

    The Applied Materials CN CP 00 147893 is a connector receptacle housing with 9 positions, model CN CP 00 147893.

  35. 0041 32922 PartApplied Materials

    The Applied Materials 0041 32922 Part is a cover for an RF filter and Dz heater, used in the Producer GT system.

  36. MxP+ PolyApplied Materials

    The Applied Materials MxP+ Poly is a polysilicon etch chamber used in semiconductor fabrication.

  37. 0720 01756 PartApplied Materials

    The Applied Materials 0720 01756 is a connector strain relief cover with 5 positions, from the MTA series, made of nylon.

  38. 0720 12864 PartApplied Materials

    The Applied Materials 0720 12864 is a connector pin part described as a Cont Conn Pin 24-20awg Crimp Tc Alomega.

  39. 0720 02370 PartApplied Materials
  40. 0720 05119 PartApplied Materials
  41. 0620 05357 PartApplied Materials

    The Applied Materials 0620 05357 part is a cable assembly described as 'Cable Assy Shld 10m Gry W / Turck 14pos G'.

  42. CENG 2 DryApplied Materials

    The Applied Materials CENG 2 is a dry etcher used in semiconductor manufacturing.

    CategoryEtch
  43. 0720 02358 PartApplied Materials

    The Applied Materials 0720 02358 is an Applied Materials part described as 'Conn Guide Skt Corner 104cf Pos'.

  44. 1270 00169 SW FlowApplied Materials
  45. 0720 03038 PartApplied Materials
  46. UVision 3Applied Materials

    The Applied Materials UVision 3 is a DUV brightfield wafer inspection tool introduced in 2007, offering 40% faster throughput and 20 nm sensitivity for 45 nm FEOL and immersion lithography.

  47. 0720 01297 PartApplied Materials

    The Applied Materials 0720 01297 part is a connector socket contact for 20-14 AWG wire, made of brass with gold plating.

  48. GF HW WS 116292 PartApplied Materials
  49. 3690 00252 PartApplied Materials
  50. GF HW SC 137702 PartApplied Materials
  51. 0041-26723 Bonded AssemblyApplied Materials

    The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.

    CategoryPackaging & Bonding
  52. 0190-70060 Magnet DriverApplied Materials
  53. 0010-30139 PartApplied Materials
  54. G 3 Lite SEM ReviewApplied Materials

    The Applied Materials G 3 Lite is a scanning electron microscope (SEM) for review applications.

    CategoryMetrology & Inspection
  55. 0720 01342 PartApplied Materials

    The Applied Materials 0720 01342 is a connector socket part with crimp termination for 22-30 AWG wire.

  56. Centura 5200 MainframeApplied Materials

    The Applied Materials Centura 5200 Mainframe is a semiconductor wafer processing platform used in fabrication facilities.

  57. 3160 00143 PartApplied Materials
  58. VIISta HE XPApplied Materials

    The VIISta HE XP is a high-current ion implanter for semiconductor wafer processing.

    CategoryIon Implantation
  59. 1330 01009 PartApplied Materials
  60. 0720 05835 PartApplied Materials

    The Applied Materials 0720 05835 Part is a contact socket (Cont Skt) with crimp termination, phosphor bronze base, and gold/nickel plating.