Waferpedia

Tool family

ASM Eagle

ASMDeposition6 entries

Models in this family

  1. ASM Eagle is a PECVD (plasma-enhanced chemical vapor deposition) system described as a 2-chamber unit with SiH4, N2O, and C3F8 gases.

  2. The ASM Eagle Express GoCu is a wire bonder.

  3. ASM Eagle XP is an ALD (Atomic Layer Deposition) system with a 12-inch wafer size.

  4. The ASM Eagle XP 5 is a bonder described as a PE-ALD system mainframe with PC and software.

  5. The ASM Eagle XP 5 PE-ALD is a plasma-enhanced atomic layer deposition system.

  6. The ASM Eagle Xtreme is a wire bonder.

All entries

  1. EagleASM

    ASM Eagle is a PECVD (plasma-enhanced chemical vapor deposition) system described as a 2-chamber unit with SiH4, N2O, and C3F8 gases.

    CategoryDeposition
    12 specs
  2. Eagle Express GoCuASM

    The ASM Eagle Express GoCu is a wire bonder.

    CategoryPackaging & Bonding
    5 specs
  3. Eagle XPASM

    ASM Eagle XP is an ALD (Atomic Layer Deposition) system with a 12-inch wafer size.

    CategoryDeposition
    16 specs
  4. Eagle XP 5ASM

    The ASM Eagle XP 5 is a bonder described as a PE-ALD system mainframe with PC and software.

    CategoryPackaging & Bonding
    8 specs
  5. Eagle XP 5 PE-ALDASM

    The ASM Eagle XP 5 PE-ALD is a plasma-enhanced atomic layer deposition system.

    CategoryDeposition
    1 spec
  6. Eagle XtremeASM

    The ASM Eagle Xtreme is a wire bonder.

    CategoryPackaging & Bonding
    1 spec