Waferpedia

Tool family

ASM Eagle Aero

Models in this family

  1. The ASM Eagle AERO is an automatic ball wire bonding machine for high-end IC packaging, utilizing X-Power thermosonic bonding technology and capable of 22 µm bonded ball size.

    Cited variants

    DesignationGenerationVintageChangesSource
    iHawk AEROfor low pin count discrete applicationssemi.asmpt.com[1]

All entries

  1. Eagle AeroASM

    The ASM Eagle AERO is an automatic ball wire bonding machine for high-end IC packaging, utilizing X-Power thermosonic bonding technology and capable of 22 µm bonded ball size.

    CategoryPackaging & Bonding
    13 specs
  2. Eagle Aero GoldASM
    CategoryPackaging & Bonding
    2 specs

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]semi.asmpt.comsemi.asmpt.com