Tool family
The ASM Eagle AERO is an automatic ball wire bonding machine for high-end IC packaging, utilizing X-Power thermosonic bonding technology and capable of 22 µm bonded ball size.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| iHawk AERO | — | — | for low pin count discrete applications | semi.asmpt.com[1] |
The ASM Eagle Aero Gold is a gold wire bonder for semiconductor packaging, employing X-Power thermosonic bonding technology and high-precision optical positioning.
The ASM Eagle AERO is an automatic ball wire bonding machine for high-end IC packaging, utilizing X-Power thermosonic bonding technology and capable of 22 µm bonded ball size.
The ASM Eagle Aero Gold is a gold wire bonder for semiconductor packaging, employing X-Power thermosonic bonding technology and high-precision optical positioning.