ASM
Eagle Aero
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASM Eagle AERO is an automatic horizontal wire bonder for high-end IC semiconductor packaging. The Eagle AERO uses X-Power thermosonic bonding technology and supports bonding balls as small as 22 µm with 0.5 mil wire. The Eagle AERO offers up to 30% higher UPH for typical copper wire applications compared to previous generations.[1][2]
What it is
The Eagle AERO is designed for high-end integrated circuit (IC) packaging applications. The system creates electrical connections between semiconductor dies and package substrates through fine wire bonding. The equipment supports high-volume automated manufacturing environments.[5][3]
How it works
The Eagle AERO uses thermosonic wire bonding technology. The machine combines ultrasonic energy and thermal energy to form bonds between wire and bonding pads.[1][5]
The machine features an automated transport system and a dual magnification optical path with dual-color coaxial light. The Eagle AERO is equipped with AeroEye management software for monitoring and quality assurance.[2][1]
Where it fits in the process flow
The Eagle AERO is a wire bonder, a type of backend semiconductor assembly equipment. Wire bonding follows die attachment and precedes encapsulation in the semiconductor packaging process flow.[5]
The Eagle AERO is used after die preparation and package loading steps. The bonding process includes automatic vision alignment, wire bonding, bond quality inspection, and then the workpieces proceed to package encapsulation and final testing.[5]
What do the numbers mean?
Power & electrical3
- Single phase[3]
Optics & imaging1
Configuration & options9
- 50/60Hz[3]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| iHawk AERO | — | — | for low pin count discrete applications | semi.asmpt.com[1] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the ASM Eagle Aero?
It is a bonder from ASM.[3]
Not publicly documented
The following facts about the Eagle Aero are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Eagle Aero are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Eagle Aero are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Eagle Aero are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Eagle Aero is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Eagle Aero are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]semi.asmpt.com — semi.asmpt.comsemi.asmpt.com
- [2]mono.ipros.com — mono.ipros.commono.ipros.com
- [3]Inventory photo
- [4]Inventory photo
- [5]wafer-equipment.com — wafer-equipment.comwafer-equipment.com
Last updated Aug 20, 2026.
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