Waferpedia

Tool family

Datacon 2200

DataconPackaging & Bonding1 entry

Datacon 2200 apm is a multi chip die bonder described as the current industry standard and based on Datacon's previous PPS 2200 Multi Chip Die Bonder platform.

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Models in this family

  1. 2200introduced 1995produced 1995–

    Datacon 2200 apm is a multi chip die bonder described as the current industry standard and based on Datacon's previous PPS 2200 Multi Chip Die Bonder platform.

    Cited variants

    DesignationGenerationVintageChangesSource
    2200 apm+———web.archive.org[1]

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org