Tool family
EVG 301 is listed as a megasonic wafer cleaning system and pre-bonding / IR imaging station with aqueous-based DI-water cleaning, direct bonding capability, and an IR-inspection module.
The EVG 301 is a semi-automated single wafer cleaning system for R&D, featuring megasonic cleaning, spinner rotation up to 3000 rpm, and optional pre-bonding and IR-inspection modules.