Tool family
The EVG Gemini Automated Production Fusion Bonder is a 300mm bonding system with automated handling, recipe programming, and alignment capabilities.
The EVG Gemini Automated Production Wafer Bonder is a wafer bonder with face-to-face alignment and automation features, supporting wafers up to 8"/200mm.
The EVG Gemini Automated Production Fusion Bonder is a 300mm bonding system with automated handling, recipe programming, and alignment capabilities.
The EVG Gemini Automated Production Wafer Bonder is a wafer bonder with face-to-face alignment and automation features, supporting wafers up to 8"/200mm.