Waferpedia

Tool family

Finetech Fineplacer Lambda

Models in this family

  1. The Finetech Fineplacer Lambda is a sub-micron die bonder used for precise placement and bonding of components onto substrates.

  2. Finetech Fineplacer Lambda Sub Micron is a die bonder with 0.5 µm accuracy and options including a bonding force module, chip heating module, and dispensing module.

All entries

  1. Fineplacer LambdaFinetech

    The Finetech Fineplacer Lambda is a sub-micron die bonder used for precise placement and bonding of components onto substrates.

    CategoryPackaging & Bonding
    12 specs
  2. Fineplacer Lambda Sub MicronFinetech

    Finetech Fineplacer Lambda Sub Micron is a die bonder with 0.5 µm accuracy and options including a bonding force module, chip heating module, and dispensing module.

    CategoryPackaging & Bonding
    6 specs