Tool family
The Finetech Fineplacer Lambda is a sub-micron die bonder used for precise placement and bonding of components onto substrates.
Finetech Fineplacer Lambda Sub Micron is a die bonder with 0.5 µm accuracy and options including a bonding force module, chip heating module, and dispensing module.
The Finetech Fineplacer Lambda is a sub-micron die bonder used for precise placement and bonding of components onto substrates.
Finetech Fineplacer Lambda Sub Micron is a die bonder with 0.5 µm accuracy and options including a bonding force module, chip heating module, and dispensing module.