Finetech

Finetech Lambda is a die bonder with sub-micron placement accuracy, supporting thermocompression and ultrasonic bonding.

The Finetech Fineplacer Lambda is a sub-micron die bonder used for precise placement and bonding of components onto substrates.

The Finetech A 4 V HD 700 is a semi-automatic bonder capable of thermocompression and thermosonic bonding.

The Finetech Fineplacer 96 is a die bonder with optional modules including flip chip, epoxy dispenser, pick & place, UV curing, heat plate, wafer ring holder, accessories, and isolated table.

Finetech Fineplacer Lambda Sub Micron is a die bonder with 0.5 µm accuracy and options including a bonding force module, chip heating module, and dispensing module.