Tool family
The Onto Innovation / Rudolph MetaPulse 200 C is a film thickness measurement system for 8-inch wafers.
The Onto / Rudolph MetaPulse 200 is a film metrology tool for 8-inch wafers.
The Onto / Rudolph MetaPulse 200 is a film thickness measurement system for 8-inch wafers.
The Onto Innovation MetaPulse 200 XCu Metal Film Measurement System is a contactless metal thickness measurement tool with wafer mapping, micro spot optics, multi-layer film capacity, and a PC controller.
The Onto Innovation / Rudolph MetaPulse 200 C is a film thickness measurement system for 8-inch wafers.
The Onto / Rudolph MetaPulse 200 is a film metrology tool for 8-inch wafers.
The Onto / Rudolph MetaPulse 200 is a film thickness measurement system for 8-inch wafers.
The Onto Innovation MetaPulse 200 XCu Metal Film Measurement System is a contactless metal thickness measurement tool with wafer mapping, micro spot optics, multi-layer film capacity, and a PC controller.