Waferpedia

Tool family

Onto Innovation MetaPulse 200

Onto Innovation6 entries

Models in this family

  1. The Onto Innovation / Rudolph MetaPulse 200 C is a film thickness measurement system for 8-inch wafers.

  2. The Onto / Rudolph MetaPulse 200 is a film metrology tool for 8-inch wafers.

  3. The Onto / Rudolph MetaPulse 200 is a film thickness measurement system for 8-inch wafers.

  4. The Onto Innovation MetaPulse 200 XCu Metal Film Measurement System is a contactless metal thickness measurement tool with wafer mapping, micro spot optics, multi-layer film capacity, and a PC controller.

All entries

  1. MetaPulse 200 C Film Thickness MeasurementOnto Innovation

    The Onto Innovation / Rudolph MetaPulse 200 C is a film thickness measurement system for 8-inch wafers.

    6 specs
  2. MetaPulse 200 Film MetrologyOnto Innovation

    The Onto / Rudolph MetaPulse 200 is a film metrology tool for 8-inch wafers.

    CategoryMetrology & Inspection
    7 specs
  3. MetaPulse 200 Film Thickness MeasurementOnto Innovation

    The Onto / Rudolph MetaPulse 200 is a film thickness measurement system for 8-inch wafers.

    CategoryMetrology & Inspection
    6 specs
  4. MetaPulse 200 Metal Film MeasurementOnto Innovation
    7 specs
  5. MetaPulse 200 X Cu Film MetrologyOnto Innovation
    CategoryMetrology & Inspection
    1 spec
  6. MetaPulse 200 XCu Metal Film MeasurementOnto Innovation

    The Onto Innovation MetaPulse 200 XCu Metal Film Measurement System is a contactless metal thickness measurement tool with wafer mapping, micro spot optics, multi-layer film capacity, and a PC controller.

    WaferWafer Mapping
    20 specs