Onto Innovation

The ONTO / Rudolph S 3000 S is a focused beam laser ellipsometry tool.

The ONTO / Rudolph MP 1 300 is a 300 mm wafer film thickness measurement tool.

The ONTO / Rudolph MP 300 XCU is a Cu film thickness measurement tool for 12-inch wafers.

The Onto Innovation NSX 105 Macro Defect is a macro defect inspection system for 300 mm wafers.

The MetaPULSE G is a measurement system for opaque thin films on 6-inch wafers, manufactured by Rudolph Technologies (now Onto Innovation).

The Onto / Nanometrics NanoSpec 8000 X is a film thickness measurement system stated to be configured for 6-inch wafers.

The Onto Innovation / Nanometrics HL 5500 is a Hall Effect Measurement System for semiconductor characterization.

The Onto Innovation / Rudolph F 30 is a semiconductor equipment tool that supports 12-inch wafers.

The Onto Innovation MetaPulse 200 XCu Metal Film Measurement System is a contactless metal thickness measurement tool with wafer mapping, micro spot optics, multi-layer film capacity, and a PC controller.

Onto Innovation NSX is an auto visual inspection (AVI) equipment model.