Tool family
The Onto Innovation MP 300 is a metrology and inspection tool family used for metal film thickness measurement on wafers.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MP 300 Metal Film Thickness | — | — | Configured for metal film thickness measurement. | waferpedia.com[1] |
| MP 300 Metal Film Thickness Measurement | — | — | Configured for metal film thickness measurement. | waferpedia.com[2] |
| MP 300 XCU Cu Film Thickness Measurement | — | — | Configured for Cu film thickness measurement on 12-inch wafers. | waferpedia.com[3] |
The MP 300 Metal Film Thickness tool from Onto Innovation is a metrology and inspection system designed to measure metal film thickness on wafers of 4, 6, 8, and 12 inches.
The Onto Innovation MP 300 is a metrology and inspection tool family used for metal film thickness measurement on wafers.
The MP 300 Metal Film Thickness tool from Onto Innovation is a metrology and inspection system designed to measure metal film thickness on wafers of 4, 6, 8, and 12 inches.