Tool family
Oxford Instruments Plasmalab 133 is a PECVD (plasma-enhanced chemical vapor deposition) system.
The Oxford Instruments Plasmalab 180 ICP is an inductively coupled plasma (ICP) high-density etching system configured for reactive ion etching, with a maximum substrate size of 150 mm and a current configuration for 100 mm wafers.
Oxford Instruments Plasmalab 133 is a PECVD (plasma-enhanced chemical vapor deposition) system.
The Oxford Instruments Plasmalab 180 ICP is an inductively coupled plasma (ICP) high-density etching system configured for reactive ion etching, with a maximum substrate size of 150 mm and a current configuration for 100 mm wafers.