Waferpedia

Tool family

Oxford Instruments Plasmalab

Models in this family

  1. Oxford Instruments Plasmalab 133 is a PECVD (plasma-enhanced chemical vapor deposition) system.

  2. The Oxford Instruments Plasmalab 180 ICP is an inductively coupled plasma (ICP) high-density etching system configured for reactive ion etching, with a maximum substrate size of 150 mm and a current configuration for 100 mm wafers.

All entries

  1. Plasmalab 133Oxford Instruments

    Oxford Instruments Plasmalab 133 is a PECVD (plasma-enhanced chemical vapor deposition) system.

    CategoryDeposition
    2 specs
  2. Plasmalab 180 ICPOxford Instruments

    The Oxford Instruments Plasmalab 180 ICP is an inductively coupled plasma (ICP) high-density etching system configured for reactive ion etching, with a maximum substrate size of 150 mm and a current configuration for 100 mm wafers.

    CategoryEtch
    12 specs