Oxford Instruments
Plasmalab 180 ICP
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Oxford Instruments Plasmalab 180 ICP is an inductively coupled plasma (ICP) high-density etching system configured for reactive ion etching. The Plasmalab System 100 ICP 180 is a load-locked plasma etching system with fully automatic computer control. The Oxford Instruments Plasmalab 180 ICP has a maximum substrate size of 150 mm and is currently configured for 100 mm wafers.[1]
What it is
The Oxford Instruments Plasmalab 180 ICP is an inductively coupled plasma (ICP) high density etching system.[1]
The system is a computer-controlled, load locked plasma etching system configured for reactive ion etching with an ICP source.[1]
How it works
The Plasmalab 180 ICP uses an inductively coupled plasma source to generate a high density plasma for etching.[1]
The system features a load locked architecture that separates the process chamber from the ambient environment, enabling automatic wafer handling.[1]
An Alcatel turbo pump with a controller and a roughing pump provides vacuum, while a gas box with six mass flow controller (MFC) gas channels manages process gas delivery.[1]
Where it fits in the process flow
Applications
Previously used process gases for the system include CHF3, CHF4, C3F8, C4F8, argon, oxygen, hydrogen, and chlorine, indicating capability for etching silicon, silicon dioxide, silicon nitride, and other materials.[1]
What do the numbers mean?
Power & electrical2
Vacuum & pumping2
Wafer handling6
- Process type
- Load locked plasma etching system configured for reactive ion etching with ICP source[1]
Gas & chemistry3
Control & software2
Configuration & options6
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Vacuum systemAlcatel turbo pump with controller and roughing pump[1]
- Gas boxSix MFC gas controllers[1]
- Previously used process gasesCHF3/CHF4, C3F8, C4F8, argon, oxygen, hydrogen, chlorine[1]
- Electrical rating208V, 3-phase, 50/60 Hz[1]
- PumpAlcatel turbo pump with controller and roughing pump[1]
- Previously used gasesCHF3/CHF4, C3F8, C4F8, Argon, Oxygen, Hydrogen, Chlorine[1]
- Power208V, 3 Ph, 50/60 Hz[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of etch system is the Oxford Instruments Plasmalab 180 ICP?
The Oxford Instruments Plasmalab 180 ICP is an ICP inductively coupled plasma high density etching system. The Plasmalab System 100 ICP 180 is a load locked plasma etching system configured for reactive ion etching with an ICP source.[1]
What substrate size does the Oxford Instruments Plasmalab 180 ICP support?
The Oxford Instruments Plasmalab 180 ICP has a maximum substrate size of 150 mm. The Oxford Instruments Plasmalab 180 ICP is currently configured for 100 mm wafers.[1]
How is the Oxford Instruments Plasmalab 180 ICP controlled and cooled at the wafer?
The Oxford Instruments Plasmalab 180 ICP is controlled by computer and provides fully automatic operation. The Oxford Instruments Plasmalab 180 ICP uses a mechanically clamped chuck and backside helium cooling.[1]
What pumping and gas control hardware is included on the Oxford Instruments Plasmalab 180 ICP?
The Oxford Instruments Plasmalab 180 ICP includes an Alcatel turbo pump with controller and a roughing pump. The Oxford Instruments Plasmalab 180 ICP includes a gas box with six MFC gas controllers.[1]
Not publicly documented
The following facts about the Plasmalab 180 ICP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 180 ICP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab 180 ICP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab 180 ICP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab 180 ICP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab 180 ICP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
- [2]Inventory photo
Last updated Oct 17, 2026.
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