Oxford Instruments

The Oxford 100 Plus Nitride is a nitride deposition system made by Oxford.

The Oxford NGP80 RIE is a plasma etch system located in room W1-062.

The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.

The Oxford Plasmalab 100 RIE is a reactive ion etching platform for dielectric etching, MEMS, and R&D applications.

The Oxford 100 Nitride is a deposition system manufactured by Oxford Instruments for depositing nitride layers.

The Oxford PRS900 is a computer-driven barrel reactor dedicated to dry resist stripping.

The Oxford PlasmaPro 100 Cobra is an etcher with 8 inch wafer size, an ICP chamber with Cl2 and BCl3 capability, and three RIE chambers.

The Oxford 80 Plus RIE is a reactive ion etcher.

The Oxford Instruments Plasmalab 180 ICP is an inductively coupled plasma (ICP) high-density etching system configured for reactive ion etching, with a maximum substrate size of 150 mm and a current configuration for 100 mm wafers.

The Oxford 26286 is a cryostat manufactured by Oxford Instruments.

The Oxford Instruments Plasmalab ICP 380 ICP-RIE is an inductively coupled plasma reactive ion etch system.

Oxford Instruments Plasmalab 80 Plus RIE is a reactive ion etcher with support for wafers up to 8 inches.

The Oxford Instruments Ionfab 300 Plus is an ion beam etching and deposition system with SIMS endpoint detection, reported with wafer handling options from small samples to 8-inch wafers.

Oxford Instruments PlasmaPro NGP 1000 is a PECVD system described as capable of running up to 450 mm wafers.

Oxford Instruments PlasmaPro80 is an RIE dry etcher used for hBN, SiGe, graphite, and graphene etching.

The PlasmaLab M80 Plus – Chlorine is an open load reactive ion etch system for etching compound semiconductors and metals.

The Oxford Plasmalab 100 ICP 180 is an inductively coupled plasma reactive ion etch system for 2 inch wafers.

The Oxford Instruments Plasmalab80 is a tool that combines etch and deposition capabilities, with plasma etching, materials growth, and wafer processing up to 8-inch diameter wafers.

Oxford PlasmaPro100 is an ICP plasma etcher for 100mm wafers used for chlorine and bromine chemistry.

Oxford Instruments Plasmalab 80+ is a compact open-loading reactive ion etch system for R&D or small-scale production.

The Oxford Instruments ITC 503 S is a temperature controller with stated power requirements of 100/115 V 7.0 A 250 V~ and 200/230 V 10.0 A.

Oxford Instruments Ionfab 300 Plus IBD / IBE Tool is an ion beam deposition and ion beam etching system for 6-inch to 8-inch wafers.

Oxford Instruments Plasmalab 80 uP RIE is a reactive ion etcher that was mainly used for O2 plasma processing and includes a vacuum pump.

Oxford Instruments Plasmalab 100 Plus RIE is a reactive ion etcher with a load-locked system and a gas module set up for Ar, O2, Cl2, and SiCl4.

The Oxford Instruments Plasmalab 800 Plus RIE is a reactive ion etching system described with a PC controller, four gas mass flow controllers, and a 460 mm diameter electrode.

Oxford Instruments FlexAL is an atomic layer deposition system compatible with TiN, TaN, TiO, TaO, and SiN.

Oxford Instruments 800 Plus is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.

The Oxford 80 Plus is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.

Oxford Instruments PlasmaPro 100 Cobra ICP-RIE is an inductively coupled plasma reactive ion etch system with process capability for wafer sizes up to 200mm.

Oxford Instruments OpAL is an atomic layer deposition system with a single open-loop chamber, heated table and sidewalls, and a downstream RF plasma head.

Oxford Ionfab 300 Plus IBD is an ion beam deposition system.