Tool family
Oxford Instruments PlasmaPro80 is an RIE dry etcher used for hBN, SiGe, graphite, and graphene etching.
Oxford Instruments PlasmaPro80 is an RIE dry etcher used for hBN, SiGe, graphite, and graphene etching.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Oxford PlasmaPro80, RIE dry etcher, fluorine chemistry (RIE 1) | — | — | ONLY hBN, SiGe, Graphite and Graphene etching; RIE plasma etcher; CHF3, SF6, O2, Ar; max 300W @ 13.56MHz; open-load system (no load lock); chips to wafer up to 200mm; hBN, SiGe, Graphite and Graphene soft etching. | epfl.ch[1] |
| Oxford PlasmaPro80, RIE dry etcher, fluorine chemistry (RIE 2) | — | — | ONLY Nb/Ti/Ta based samples; RIE plasma etcher; 100mm wafers; CF4, CHF3, SF6, O2, Ar; max 300W @ 13.56MHz; open-load system (no load lock); Nb, Ta and superconducting nitride thin-films etching; laser reflectometry/interferometry end-point-detection. | epfl.ch[1] |