Tool family
The Plasma-Therm 770 is described as a fluorine-based ICP dry etcher with loadlock, ICP coil, substrate RF bias, helium backside cooling, and Windows-based computer control.
The Plasma-Therm 770 SLR series is an inductively coupled plasma (ICP) etch system used for dry etching of materials such as silicon, SiO₂, Si₃N₄, and compound semiconductors.