Plasma-Therm

The Plasmatherm Core Interface is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.

The Plasma Therm 720/740 is a dual-chamber RIE loadlocked system with chlorine- and fluorine-based chemistry.

The Plasma-Therm 770 SLR series is an inductively coupled plasma (ICP) etch system used for dry etching of materials such as silicon, SiO₂, Si₃N₄, and compound semiconductors.

The Plasma-Therm 790 Multi-Process is an etch system for 6-inch wafers.

The Plasma-Therm SLR 770 ICP Deep Silicon Etcher is a single-chamber inductively coupled plasma etcher configured for 4-inch wafers.

The Plasma-Therm Versaline LACVD is an etch system for 6-inch wafers.

The Plasma-Therm 790 RIE-PECVD is a single-chamber reactive ion etcher / plasma-enhanced chemical vapor deposition system.

The Plasma-Therm Unaxis 790 is a reactive ion etcher / ICP plasma etch system used for etching polymer, dielectric, silicon, silicon oxide, and silicon nitride materials.

The Plasma-Therm SLR-770 ICP is a chlorine etcher configured as an inductively coupled plasma etch system with vacuum load lock and wafer transfer robot.

Plasma-Therm / Unaxis ICP Etcher is an inductively coupled plasma etcher with wafer auto load/unload and support for 2, 3, 4, 6, and 8 inch wafers.

The Plasma-Therm 790 Series RIE is a reactive ion etcher for 6-inch wafers.

The Plasma-Therm SLR 770 Metal is a dual-chamber 4-inch metal etcher with load-locked sample introduction and turbomolecular pumping.

The Plasma-Therm Versaline ICP Deep Silicon Etcher is an inductively coupled plasma etcher with stated 208/220 VAC, 3 phase, 30 A, 4-wire, 50/60 Hz requirements.

The Plasma-Therm 720 RIE is a reactive ion etcher configured for 4-inch wafers.

PlasmaTherm RIE790 is a reactive ion etch tool listed in the NanoFab dry etch equipment inventory.

The Plasma-Therm Versalock 700 ICP is an inductively coupled plasma etcher.

The Plasma-Therm Shuttleline ICP Etcher is an inductively coupled plasma etcher for 6-inch wafers.

General referencePlasma-Therm Versaline is a deposition system. Machines of this class are used to form thin material films on prepared substrates for semiconductor and related precision-process applications.

The Plasma-Therm Versaline VCX 600 ICP is a 6-inch inductively coupled plasma etch system.

The Plasmatherm / Unaxis 790 RIE is a reactive ion etcher specified for 6-inch wafers.

The Plasma-Therm SLR 720 RIE is a reactive ion etcher.

The Plasma-Therm SLR 770 is a reactive ion etcher.

The Plasma-Therm Versaline ICP Etcher is an inductively coupled plasma etcher.