Plasma-Therm

The Powermax65 SYNC is a 65 amp plasma cutting and gouging system with SmartSYNC torch and cartridge technology. The Powermax65 SYNC operates on single- or 3-phase 200V to 600V input power and is offered in handheld and machine-torch configurations.

The Powermax105 SYNC is a Hypertherm plasma cutting and gouging system.

The Plasma Therm 720/740 is a dual-chamber RIE loadlocked system with chlorine- and fluorine-based chemistry.

The Hypertherm Powermax65 SYNC is a plasma cutting and gouging system for handheld and automated cutting of metals.

The Plasma-Therm Corial 200R is a Corial-brand product for low-volume production and experimentation.

General referenceThe Plasma-Therm VLR is identified here only as a test and probe tool. In this equipment class, such systems are used to make controlled electrical contact to device pads or test structures so measurements can be taken before assembly or at intermediate manufacturing stages.

The Plasma-Therm 720 RIE is a reactive ion etcher configured for 4-inch wafers.

The Plasma-Therm Versaline is a semiconductor processing platform used for plasma-enhanced chemical vapor deposition (PECVD) and deep reactive-ion etching (DRIE), configured for 4-inch wafers.

The XPR170 is a Hypertherm plasma cutting system in the XPR product line.

The XPR460 is a plasma cutting system in the XPR product line.

The Plasma-Therm Versaline VCX 600 ICP is a 6-inch inductively coupled plasma etch system.

The Powermax45XP is a Hypertherm plasma cutting system family reference listed among Powermax plasma products.

The Powermax85 is a plasma cutting system in the Powermax product line. The Powermax85 appears on Hypertherm’s product finder under plasma cutting and gouging systems.

The MAX42 is a model for which a Duramax retrofit torch is available.

The Plasma-Therm SEC-1000/SE-1000 is a product line listed among Plasma-Therm’s plasma processing equipment offerings.

The Plasma-Therm 790 RIE is a reactive ion etch system configured for silicon substrate processing.

The Plasma-Therm 770 SLR series is an inductively coupled plasma (ICP) etch system used for dry etching of materials such as silicon, SiO₂, Si₃N₄, and compound semiconductors.

The Plasma-Therm Versaline ICP Etcher is an inductively coupled plasma etcher.

The Plasma-Therm DSB 6000 HDRF Plasma Processor is a plasma processing system.

The Plasma-Therm Unaxis Versaline ICP is an inductively coupled plasma etcher.

The Powermax30 AIR is a plasma cutting system in Hypertherm’s Powermax product line. The Powermax30 AIR appears in Hypertherm’s product finder for plasma cutting and gouging systems.

The Plasma-Therm Powermax30 XP is a plasma cutting and gouging system from the Powermax product line.

The Plasma-Therm Dual SLR ICP is an inductively coupled plasma etcher.

The Powermax45 SYNC is a Hypertherm plasma cutting system in the Powermax plasma product line.

The Plasma-Therm 790 Multi-Process is an etch system for 6-inch wafers.

The HPR400XD is a Hypertherm plasma cutting and gouging system in the HPR plasma product line.

The Powermax600 is a plasma product line associated with the Powermax family.

The Corial 200FA is a Plasma-Therm Corial-brand RIE etch system for IC failure analysis applications.

The Plasma-Therm SLR 770 ICP Deep Silicon Etcher is a single-chamber inductively coupled plasma etcher configured for 4-inch wafers.

The Plasmatherm / Unaxis 790 RIE is a reactive ion etcher specified for 6-inch wafers.

The Powermax33 XP is a Hypertherm plasma cutting system in the Powermax product line.

The Powermax105 is a Hypertherm plasma cutting system line identified on Hypertherm's product page as Powermax105 SYNC.

The Plasma-Therm SLR 770 Metal is a dual-chamber 4-inch metal etcher with load-locked sample introduction and turbomolecular pumping.

The Plasma-Therm SSC-1000 is a product line listed among Plasma-Therm plasma processing equipment offerings.

The Plasma-Therm RIE 790 Etching is an etch tool.

The Plasma-Therm Mark 40 is a wafer-based plasma processing system listed in Plasma-Therm's product lineup for etching and deposition applications.

The Plasma-Therm Unaxis 790 is a reactive ion etcher / ICP plasma etch system used for etching polymer, dielectric, silicon, silicon oxide, and silicon nitride materials.

The Plasma-Therm 210RL-B is a reactive ion etcher (RIE) tool used for dry etching processes.

The Plasma-Therm Versaline VLN ICP is an inductively coupled plasma etcher.

General referenceThe Plasma-Therm 210RL-A is a reactive-ion etch (RIE) system designed for semiconductor and microelectromechanical systems (MEMS) fabrication, belonging to the class of plasma-based dry etching equipment.

The Plasma-Therm Versaline ICP Deep Silicon Etcher is an inductively coupled plasma etcher with stated 208/220 VAC, 3 phase, 30 A, 4-wire, 50/60 Hz requirements.

The Plasma-Therm PT 7300 is a plasma-enhanced chemical vapor deposition (PECVD) system.

The Plasma-Therm SEC-600/SE-600 is a Plasma-Therm product line referenced on a Plasma-Therm equipment page. The source does not state the tool type or process function for the SEC-600/SE-600.

The Powermax85 SYNC is a plasma cutting system in Hypertherm’s Powermax SYNC product line.

The Powermax1000 is a plasma cutting and gouging system associated with Hypertherm's Powermax product family.

The Plasma-Therm SLR-770 ICP is a chlorine etcher configured as an inductively coupled plasma etch system with vacuum load lock and wafer transfer robot.

The MAXPRO200 is a heavy-duty, high-capacity automated and handheld plasma cutting and gouging system from Hypertherm.

The Powermax125 is a Hypertherm plasma cutting system in the Powermax product line. Hypertherm describes Powermax systems as portable plasma cutters with handheld and automated cutting, marking, and gouging capabilities.

The XPR300 is a Hypertherm plasma cutting system in the XPR plasma product line.

The Hypertherm HT2000 is a plasma cutting system that supports the HyPro2000 retrofit torch.

The MAX200 is a Hypertherm plasma product for which a HyPro2000 retrofit torch is offered.

The Plasma-Therm Versaline LACVD is an etch system for 6-inch wafers.

Plasma-Therm / Unaxis ICP Etcher is an inductively coupled plasma etcher with wafer auto load/unload and support for 2, 3, 4, 6, and 8 inch wafers.

The Plasma-Therm 790 Series RIE is a reactive ion etcher for 6-inch wafers.

The HPR800XD is a Hypertherm plasma cutting system in the HPR plasma product line.

The Plasma-Therm Shuttleline ICP Etcher is an inductively coupled plasma etcher for 6-inch wafers.

The Plasma-Therm Versalock 700 ICP is an inductively coupled plasma etcher.