Tool family
Plasma-Therm 790 is listed as a PECVD tool in the UCSB Nanofab tool list, and a Plasma-Therm page states that the 790+ series are open-load etch and deposition systems.
The Plasma-Therm 790 is a PECVD system used for thin film deposition.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 790+ | — | — | Predecessor to Advanced Vacuum Vision 300 and 400 open-load etch and deposition systems. | web.archive.org[1] |
| Plasma-Therm 790 MF | — | — | described as a stand-alone RIE system with showerhead gas distribution and a water cooled RF platen | mrl.illinois.edu[2] |
| PlasmaTherm 790 RIE | — | — | described as a reactive ion etcher configured for silicon substrate processing and manually loaded substrates up to 8 inches in diameter | research.engineering.ucdavis.edu[3] |
| PlasmaTherm 790 | — | — | described as a parallel plate plasma etching system for silicon nitride thin films | nist.gov[4] |