Plasma-Therm

790

Research Quality: 20% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Plasma-Therm790

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What is it?

The sources identify Plasma-Therm 790 as PECVD 1 in the UCSB Nanofab tool list. A Plasma-Therm page further states that Advanced Vacuum’s Vision 300 and 400, formerly Plasma-Therm 790+ series, are open-load etch and deposition systems, and that the Apex SLR continues Plasma-Therm’s Shuttlelock system.

What do the numbers mean?

Configuration & options3

Tool name: PECVD 1 (PlasmaTherm 790)^[1]
System type: open-load etch and deposition systems^[2]
Series reference: formerly Plasma-Therm 790+ series^[2]

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Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the 790 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 790 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 790 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 790 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 790 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 790 is not on record.
Answerable by: an OEM datasheet or a fab qualification report