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Plasma-Therm

790

DepositionPlasma-Therm 790 family
Research Quality: 40% complete
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This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Plasma-Therm790
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Power

water cooled RF platen[3]

Vacuum

10 mTorr to 100 mTorr[3]

Gas delivery

Chemical Vapor Deposition (CVD)[1]

What is it?

Applications

Typical application areas include microelectromechanical systems (MEMS), photonics, solid-state lighting, and failure or yield analysis. The system is suitable for processing substrates for prototyping, pilot lines, and low-volume production.[2]

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Etching of organic substances is prohibited in one facility listing.
  • The tool is reserved for silicon, silicon nitride, and silicon dioxide in one facility listing.

What do the numbers mean?

Power & electrical3

Platen
water cooled RF platen[3]
Accurate?
RF power
500 W, 13.56 MHz[3]
Accurate?
RF power range
up to 500 W at 13.56 MHz[5]
Accurate?

Vacuum & pumping2

Pressure range
10 mTorr to 100 mTorr[3]
Accurate?
Pressure range
less than 900 mTorr[4]
Accurate?

Wafer handling3

Maximum wafer diameter
200 mm (8 in.)[4]
Accurate?
Supported sample size
200 mm maximum wafer diameter[5]
Accurate?
Supported sample size
substrates up to 8 inches in diameter[6]
Accurate?

Gas & chemistry5

Category
Chemical Vapor Deposition (CVD)[1]
Accurate?
Gas distribution
showerhead gas distribution[3]
Accurate?
Process gases
CF4, CHF3, SF6, and O2[3]
Accurate?
Process gases
Ar, O2, CF4, CHF3, N2, and SF6[5]
Accurate?
Process gases
SF6, CHF3, CF4, O2, and Ar[4]
Accurate?

Configuration & options10

Tool name
PECVD 1 (PlasmaTherm 790)[1]
Accurate?
System type
open-load etch and deposition systems[2]
Accurate?
Series reference
formerly Plasma-Therm 790+ series[2]
Accurate?
Process type
PECVD[1]
Accurate?
Archived series reference
formerly Plasma-Therm 790+ series open-load etch and deposition systems[2]
Accurate?
Tool list designation
PECVD 1 (PlasmaTherm 790)[1]
Accurate?
System type
stand-alone Reactive Ion Etching (RIE) system[3]
Accurate?
Platen size
279 mm[4]
Accurate?
Material compatibility
silicon, silicon dioxide, or silicon nitride[3]
Accurate?
Material compatibility
silicon nitride thin films[5]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
790+——Predecessor to Advanced Vacuum Vision 300 and 400 open-load etch and deposition systems.web.archive.org[2]
Plasma-Therm 790 MF——described as a stand-alone RIE system with showerhead gas distribution and a water cooled RF platenmrl.illinois.edu[3]
PlasmaTherm 790 RIE——described as a reactive ion etcher configured for silicon substrate processing and manually loaded substrates up to 8 inches in diameterresearch.engineering.ucdavis.edu[6]
PlasmaTherm 790——described as a parallel plate plasma etching system for silicon nitride thin filmsnist.gov[5]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • CategoryChemical Vapor Deposition (CVD)[1]
  • Gas distributionshowerhead gas distribution[3]
  • Platenwater cooled RF platen[3]
  • RF power500 W, 13.56 MHz[3]
  • RF power rangeup to 500 W at 13.56 MHz[5]
  • Pressure range10 mTorr to 100 mTorr[3]
  • Pressure rangeless than 900 mTorr[4]
  • Process gasesCF4, CHF3, SF6, and O2[3]
  • Process gasesAr, O2, CF4, CHF3, N2, and SF6[5]
  • Process gasesSF6, CHF3, CF4, O2, and Ar[4]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the primary function of the Plasma-Therm 790?

The Plasma-Therm 790 is a PECVD system used for depositing thin films.[1]

Not publicly documented

The following facts about the 790 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 790 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 790 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the 790 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 790 are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the 790 are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

Sources & citations

Sources (8)Every fact above is drawn from these public sources
  1. [1]wiki.nanotech.ucsb.edu — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]mrl.illinois.edu — mrl.illinois.edumrl.illinois.edu
  4. [4]cores.research.asu.educores.research.asu.edu
  5. [5]nist.gov — nist.govnist.gov
  6. [6]research.engineering.ucdavis.edu — research.engineering.ucdavis.eduresearch.engineering.ucdavis.edu
  7. [7]Tool List - UCSB Nanofab Wiki — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
  8. [8]Tool List - UCSB Nanofab Wiki — wiki.nanofab.ucsb.eduwiki.nanofab.ucsb.edu
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Last updated Oct 20, 2026.

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