Tool family
The STS Multiplex ICP is a load-locked inductively coupled plasma etch system used for deep silicon etching using the Bosch process.
The STS Multiplex ICP Advanced Oxide Etcher (AOE) is a semi-auto carousel etcher for 6-inch to 8-inch wafers.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| STS Multiplex ICP ASE Advanced Silicon Etch (ASE) system, 6" - Manual load lock | — | — | Manual load lock; He Backside Cooling 150mm clamp configuration; ENI 300/30 Watt 13.56MHz RF power supply; Leybold Mag 2000CT Turbo pump with Leybold Mag Drive Controller; OnBoard gas panel. | Equipment inventory listing[1] |
| STS Multiplex ICP ASE Advanced Silicon Etch (ASE) system, 6" - Manual load lock – Carousel Loader | — | — | Manual load lock; Carousel Loader; He Backside Cooling 150mm clamp configuration; ENI ACG-3 300/30 Watt 13.56MHz RF power supply; Pfeiffer TMH 1000PC Turbo pump with Pfeiffer Turbo Controller; Remote gas panel. | Equipment inventory listing[2] |
The STS Multiplex ICP is a load-locked inductively coupled plasma etch system used for deep silicon etching using the Bosch process.
The STS Multiplex ICP Advanced Oxide Etcher (AOE) is a semi-auto carousel etcher for 6-inch to 8-inch wafers.