Waferpedia

Tool family

STS Multiplex ICP

STSEtch3 entries

Models in this family

  1. The STS Multiplex ICP is a load-locked inductively coupled plasma etch system used for deep silicon etching using the Bosch process.

  2. The STS Multiplex ICP Advanced Oxide Etcher (AOE) is a semi-auto carousel etcher for 6-inch to 8-inch wafers.

  3. Cited variants

    DesignationGenerationVintageChangesSource
    STS Multiplex ICP ASE Advanced Silicon Etch (ASE) system, 6" - Manual load lockManual load lock; He Backside Cooling 150mm clamp configuration; ENI 300/30 Watt 13.56MHz RF power supply; Leybold Mag 2000CT Turbo pump with Leybold Mag Drive Controller; OnBoard gas panel.Equipment inventory listing[1]
    STS Multiplex ICP ASE Advanced Silicon Etch (ASE) system, 6" - Manual load lock – Carousel LoaderManual load lock; Carousel Loader; He Backside Cooling 150mm clamp configuration; ENI ACG-3 300/30 Watt 13.56MHz RF power supply; Pfeiffer TMH 1000PC Turbo pump with Pfeiffer Turbo Controller; Remote gas panel.Equipment inventory listing[2]

All entries

  1. Multiplex ICPSTS

    The STS Multiplex ICP is a load-locked inductively coupled plasma etch system used for deep silicon etching using the Bosch process.

    CategoryEtchWafer100mm
    18 specs
  2. Multiplex ICP Advanced OxideSTS

    The STS Multiplex ICP Advanced Oxide Etcher (AOE) is a semi-auto carousel etcher for 6-inch to 8-inch wafers.

    CategoryEtch
    20 specs
  3. Multiplex ICP ASE Advanced Silicon Etch (ASE)STS
    CategoryEtch
    13 specs

Sources

Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing