Waferpedia

Tool family

SUSS MicroTec SB 6

SUSS MicroTecPackaging & Bonding2 entries
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Models in this family

  1. SB 6

    The SUSS SB 6 is a 6-inch wafer bonder with thermal compression and anodic bonding capabilities.

  2. SB 6 VAC

All entries

  1. SB 6SUSS MicroTec

    The SUSS SB 6 is a 6-inch wafer bonder with thermal compression and anodic bonding capabilities.

    CategoryPackaging & BondingWaferWafer bonding at pressures 5e-5 to 3e-3 Torr and 50*C to 550*C
    6 specs
  2. SB 6 VACSUSS MicroTec
    CategoryPackaging & Bonding
    3 specs