SUSS MicroTec

SB 6

Packaging & Bonding Wafer bonding at pressures 5e-5 to 3e-3 Torr and 50*C to 550*C SUSS MicroTec SB 6 family

Research Quality: 40% complete

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SB 6 — Inventory photo — Fig. 01SB 6Inventory photo^[1]

What is it?

The SUSS SB 6 is a 6-inch wafer bonder with thermal compression and anodic bonding capabilities.

What do the numbers mean?

Power & electrical1

Supports thermal compression and anodic bonding (up to 2000 V)^[1]

Accurate?

Vacuum & pumping1

Wafer size: Wafer bonding at pressures 5e-5 to 3e-3 Torr and 50*C to 550*C^[1]

Wafer handling1

Forces up to 20 kN for 6" wafers available^[1]

Accurate?

Control & software1

Computer controlled with Windows environment for saving data / recipes and running multiple recipe steps^[1]

Accurate?

Configuration & options2

Pneumatic Block replaced with a SMC Solenoid Block^[1]

Accurate?

Works with the Karl Suss MA6 Aligner for aligned bonding^[1]

Accurate?

Interested in this tool?

Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Wafer sizeWafer bonding at pressures 5e-5 to 3e-3 Torr and 50*C to 550*C^[1]
ConfigurationSupports thermal compression and anodic bonding (up to 2000 V)^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the SB 6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SB 6 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SB 6 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SB 6 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SB 6 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SB 6 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (5)Every fact above is drawn from these public sources

[1]Inventory photo
[2]Tool List - UCSB Nanofab Wiki — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
[3]Karl Suss SB8 Wafer Bonder | UCLA Nanolab — nanolab.ucla.edunanolab.ucla.edu
[4]Wafer bonder [SUSS-bond] | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca
[5]苏斯贸易（上海）有限公司: SB6/8e半自动晶圆键合系统: SUSS MicroTec — suss.com (Aug 8, 2010)web.archive.org