Finetech
Fineplacer 96
The Finetech Fineplacer 96 is a die bonder. The Finetech Fineplacer 96 is in the packaging and bonding category. The Finetech Fineplacer 96 has a bonding accuracy of 0.5 µm.[1][2][3]
Plate 01Virtual Product Inspection at Salvex - Finetech Fineplacer-96 with Accessories & Upgraded Options
Salvex Global MarketplaceWatch on YouTube
Wafer size
Wafer Ring Holder,
Performance
0.5 µm[3]
How it works
The Fineplacer 96 can be configured with flip-chip, epoxy dispensing, pick-and-place, UV curing, heat plate, wafer ring holder, and isolated table functions. The Fineplacer 96 is used with die attach, SMD, flip-chip, and UV wafer ring release module configurations. The Fineplacer 96 supports thermo-compression, reflow, and thermo-sonic bonding mechanisms. The Fineplacer 96 is specified with a bonding environment of nitrogen or formic acid.[1][4][3][2]
Applications
What do the numbers mean?
Wafer handling4
Performance1
Configuration & options18
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kinds of joining methods can this class of machine support?General reference — not yet source-verified
Machines of this class may support adhesive bonding, thermocompression, heat-assisted joining, ultrasonic bonding, or similar attachment methods depending on the process.
Why is precision important in this class of equipment?General reference — not yet source-verified
Small components and fine interconnect features require accurate placement, stable holding, and controlled bonding so the assembly functions correctly.
Not publicly documented
The following facts about the Fineplacer 96 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Fineplacer 96 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Fineplacer 96 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Fineplacer 96 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Fineplacer 96 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Fineplacer 96 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Finetech Fineplacer 96 family | Waferpedia — waferpedia.comwaferpedia.com
- [3]fabsurplus.com — fabsurplus.comfabsurplus.com
- [4]Inventory photo
Last updated Oct 19, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
