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Finetech

Lambda

Packaging & BondingFinetech Lambda family
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The Finetech Lambda is a die bonder with sub-micron placement accuracy of 0.5 μm. The Lambda supports thermocompression and ultrasonic bonding technologies. The Lambda runs on Windows 10 Pro and includes a 50×50 mm heating plate.[1][2][3][4]

Lambda — Inventory photo
Fig. 01LambdaInventory photo[1]

  • Plate 01FINEPLACER lambda 2 - the ultimate tool for opto assemblies

    FinetechWatch on YouTube

  • Plate 02Face-up Assembly of VCSEL and PD - FINEPLACER® lambda

    FinetechWatch on YouTube

  • Plate 03Face Down VCSEL Assembly on Transceiver Modules - FINEPLACER® lambda

    FinetechWatch on YouTube

Performance

0.5 um[1]

Gas delivery

Inert/Process Gas Enclosure[3]

Optics

Side Process Camera[1]

What it is

The Finetech Lambda is a die bonder designed for fine-pitch device assembly. The Finetech Lambda is a flip-chip bonder located at Stanford University's nanofabrication facility. The Finetech Lambda is a die bonder with sub-micron placement accuracy.[1][3][7][4]

Where it fits in the process flow

General reference — not yet source-verified

Bonding is a method used after die preparation and prior to final encapsulation or testing. The Finetech Lambda sits in the packaging process flow, typically after dicing and before wire bonding or encapsulation.

Applications

The Finetech Lambda is used for flip chip and flip chip assemblies. The Finetech Lambda is also used for optoelectronic components, micro electromechanical systems (MEMS), micro optoelectronic mechanical devices (MOEMS), sensors, bare chips, and surface mounted devices.[4]

What do the numbers mean?

Wafer handling4

100 x 100 mm Substrate Heater[1]
Accurate?
100mm substrate heater instead of 50mm[1]
Accurate?
100 x 100 mm Substrate Heater with Gel/Waffle Pack Station[3]
Accurate?
100mm substrate heater instead of 50 mm[3]
Accurate?

Gas & chemistry2

Inert/Process Gas Enclosure[3]
Accurate?
Inert/Process Gas Enclosure
Included (on asset 153908)[3]
Accurate?

Optics & imaging4

Side Process Camera[1]
Accurate?
Y Axis Camera Shifter[1]
Accurate?
Side Process Camera
Included[1]
Accurate?
Y Axis Camera Shifter
Included[1]
Accurate?

Performance2

Accuracy
0.5 um[1]
Accurate?
Placement Accuracy
0.5 μm (sub-micron)[1]
Accurate?

Control & software7

Bond Line Adjust/Control Module[1]
Accurate?
Dispense Syringe Mount Hardware – no controller[1]
Accurate?
Windows 10 Pro PC, Keyboard, Mouse & Monitor[1]
Accurate?
Finetech Software[1]
Accurate?
Dispense Syringe Mount Hardware
Included (no controller)[1]
Accurate?
Operating System
Windows 10 Pro[1]
Accurate?
Software
Finetech Software[1]
Accurate?

Configuration & options10

50 x 50 mm Heating Plate with Gel/Waffle Pack station[1]
Accurate?
Fine Theta Adjustment on Bond Head[1]
Accurate?
0.2-20N Bond Force Module[1]
Accurate?
Power
80W Contact Chip Heater (CCH) with a single heated tool[1]
Accurate?
XY & Coplanarity calibration kit[3]
Accurate?
Bond Force Range
0.2-20 N[1]
Accurate?
Heating Plate Size
50 × 50 mm[1]
Accurate?
Fine Theta Adjustment on Bond Head
Included[1]
Accurate?
Bonding Technologies
Thermocompression and ultrasonic[2]
Accurate?
XY & Coplanarity Calibration Kit
Included (on asset 153908)[3]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
FINEPLACER lambda 2———finetechusa.com[5]
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationInert/Process Gas Enclosure[3]
  • Inert/Process Gas EnclosureIncluded (on asset 153908)[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What is the placement accuracy of the Finetech Lambda?

The Finetech Lambda has a placement accuracy of 0.5 µm.[1][3]

What heating plate sizes are available for the Finetech Lambda?

The Finetech Lambda is available with a 50 x 50 mm heating plate as standard, with an optional 100 x 100 mm substrate heater.[1][3]

What bonding forces does the Finetech Lambda support?

The Finetech Lambda supports a bond force module from 0.2 N to 20 N.[1][3]

What operating system and software does the Finetech Lambda use?

The Finetech Lambda runs Windows 10 Pro and uses Finetech Software.[1][3]

Not publicly documented

The following facts about the Lambda are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Lambda are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the Lambda are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Lambda are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Lambda is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Lambda are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (7)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]epfl.ch — epfl.chepfl.ch
  3. [3]Inventory photo
  4. [4]https://nanoguide.stanford.edu/files/sections/diplayfiles/operating_instructions_finetech_bonder.pdf — nanoguide.stanford.edunanoguide.stanford.edu
  5. [5]finetechusa.com — finetechusa.comfinetechusa.com
  6. [6]Equipment inventory listing
  7. [7]Bonding | Stanford Nanofabrication Facility — snfguide.stanford.edusnfguide.stanford.edu
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Last updated Aug 20, 2026.

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