Meyer Burger
DW 288 S 4 Diamond
The Meyer Burger DW 288 S 4 Diamond Wire Saw is a multi wire saw. The Meyer Burger DW 288 S 4 Diamond Wire Saw slices semiconductor silicon and sapphire into wafer. The Meyer Burger DW 288 S 4 Diamond Wire Saw has an 8 inch capability.[1][2]
How it works
The saw employs only six pulleys for optimal diamond wire usage and supports wire speeds up to 25 m/s (1500 m/min) with a wire acceleration of 8 m/s² (achieving full speed in under 4 seconds). The minimum wire diameter is 100 μm and maximum wire tension is 45 N.[2]
Options include an adaptive feed system for optimizing the cutting process and a Diamond Wire Management System (DWMS) for monitoring and controlling wire consumption. The machine also features a cutting fluid tank of 240 liters capacity and uses a wire management system (WM2) on the DW 288 S 4 Diamond variant.[3][1]
Where it fits in the process flow
The machine can handle both semiconductor-grade silicon and sapphire ingots, and its process know-how can be transferred to other hard and brittle materials such as ceramics, quartz, or silicon carbide.[1]
What do the numbers mean?
Power & electrical5
Vacuum & pumping1
- Cutting fluid manifold without regulation valves, 1 mechanical flow meter (total cutting fluid flow controlled by pump rotation) and flow bars[3]
Wafer handling1
Optics & imaging2
Performance1
Dimensions & facilities3
Configuration & options47
- Wire Management System WM2[3]
- Rocking unit 90° clamping system and adaptive feed[3]
- Saphir cutting fluid media module with long filter[3]
- Tank drain with hand valve[3]
- Sign set in French:[3]
- Options would be necessary, to be able to run the machine in the US:[3]
- Sign set in English[3]
- Parts:[3]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Takatori WSD K 3— Same function class: Dicing & Grinding, nullCompare in depthsource[5]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationCutting fluid manifold without regulation valves, 1 mechanical flow meter (total cutting fluid flow controlled by pump rotation) and flow bars[3]
- ConfigurationStandard Europe power management (400V, 230V Schuko plugs)[3]
- ConfigurationUL conversion and voltage conversion (480V, 110V plugs)[3]
- Power & electricalStandard Europe power management (400V, 230V Schuko plugs)[4]
- US electrical conversionUL conversion and voltage conversion (480V, 110V plugs)[4]
- PowerStandard Europe power management (400V, 230V Schuko plugs)[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What cutting method does this class of machine typically use for dicing?General reference — not yet source-verified
Most combined dicing and grinding systems employ a diamond-impregnated blade rotating at high speed to cut along scribe lanes. Some advanced systems also offer a laser dicing option for materials that are difficult to machine mechanically, such as very brittle or ultra-thin substrates.
How does the machine handle wafer alignment and process monitoring?General reference — not yet source-verified
Alignment is achieved through machine vision cameras that detect marks or edges on the wafer or tape frame. The system then calculates coordinates for dicing lanes and grinding zones. Many machines incorporate in-line metrology, such as laser-based thickness measurement or acoustic sensing, to monitor grind depth and blade wear in real time.
Not publicly documented
The following facts about the DW 288 S 4 Diamond are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DW 288 S 4 Diamond are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DW 288 S 4 Diamond are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DW 288 S 4 Diamond are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DW 288 S 4 Diamond are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DW 288 S 4 Diamond is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]lapmaster-wolters.com — lapmaster-wolters.comlapmaster-wolters.com
- [2]precision-surface.com — precision-surface.comprecision-surface.com
- [3]Inventory photo
- [4]waferpedia.comwaferpedia.com
- [5]Equipment inventory listing
Last updated Oct 11, 2026.
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