Shinkawa
8-inch
The Shinkawa 8-inch is a package sorter for diced solid mold CSP and wafer level CSP. The Shinkawa 8-inch sorts diced packages attached on tape very quickly into a tray. The Shinkawa 8-inch has a sorting speed of 0.5 s/package.[1]
What it is
The Shinkawa 8-inch is a package sorter for diced solid mold CSP and wafer level CSP. The Shinkawa 8-inch sorts diced packages attached on tape into a tray. The Shinkawa 8-inch is available with a flip mechanism that attaches the ball upside down for live-bug style. The Shinkawa 8-inch can be configured for in-line processing with a dicer as an option. The Shinkawa 8-inch family also includes a DPS-260 unloader-added version for additional sorting.[1][2]
Where it fits in the process flow
General reference — not yet source-verifiedPackage sorting equipment sits in semiconductor back-end manufacturing after devices have been singulated into individual units. Package sorting equipment bridges singulation and later handling steps by organizing units into trays or comparable output media. Package sorting equipment is used where orientation control and orderly transfer are needed before subsequent assembly, inspection, or packing operations.
Applications
The Shinkawa 8-inch is intended for Mold CSP and Wafer Level CSP applications. The Shinkawa 8-inch supports diced solid mold CSP and wafer level CSP package sorting. The available flip mechanism supports live-bug style handling by attaching the ball upside down.[1][2]
- Mold CSP
- Wafer Level CSP
What do the numbers mean?
Wafer handling3
Configuration & options4
- Flip mechanism
- Available with a flip mechanism that attaches the ball upside down for live-bug style[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| DPS-260 | — | — | Unloader added version | web.archive.org[1] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of equipment is the Shinkawa 8-inch?
The Shinkawa 8-inch is a package sorter for diced solid mold CSP and wafer level CSP.[1][2]
How are parts presented and sorted on the Shinkawa 8-inch?
The Shinkawa 8-inch sorts diced packages attached on tape into a tray.[1][2]
Not publicly documented
The following facts about the 8-inch are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8-inch are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 8-inch are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8-inch are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 8-inch is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 8-inch are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]8-inch — Shinkawa | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 16, 2026.
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