Accretech

A prober positions a device wafer or other test piece so electrical contact can be made to selected sites through probe needles or probes.
A prober supports repeatable alignment between the contact system and the device under test so electrical measurements can be taken before wafer singulation or packaging.
A prober sits in the wafer test flow before downstream assembly steps.
A prober is used after device fabrication and before final packaging or other back-end processing.
A prober is used for wafer-level electrical test and characterization.
A prober is used in semiconductor production and development settings where individual device sites must be contacted for measurement or verification.
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Wafer-level probing helps identify good and bad devices early, supports process monitoring, and reduces unnecessary downstream processing of defective material.
The machine aligns probe contacts to target pads on the wafer, establishes temporary electrical contact, and passes signals to test electronics for measurement and analysis.
The following facts about the FP 3000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FP 3000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FP 3000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FP 3000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FP 3000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FP 3000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 13, 2026.
The Tenney TPS JR-A-F4T is a junior compact temperature test chamber with a 1.2 cubic foot chamber size and a temperature range of -68°C to +180°C.
The Rorze 03 RR 8120-001-001 is a wafer exchanger for 8-inch wafers.
The KLA 1007 is a wafer prober manufactured by KLA.