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Accretech

FP 3000

Test & ProbeAccretech FP 3000 family
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FP 3000 — Inventory photo
Fig. 01FP 3000Inventory photo[1]

Power

210 VAC, Single Phase[2]

Vacuum

Over −80 kPa[2]

What it is

The Accretech FP 3000 is a semiconductor prober.[1][2]

How it works

General reference — not yet source-verified

A prober positions a device wafer or other test piece so electrical contact can be made to selected sites through probe needles or probes.

A prober supports repeatable alignment between the contact system and the device under test so electrical measurements can be taken before wafer singulation or packaging.

Where it fits in the process flow

General reference — not yet source-verified

A prober sits in the wafer test flow before downstream assembly steps.

A prober is used after device fabrication and before final packaging or other back-end processing.

Applications

General reference — not yet source-verified

A prober is used for wafer-level electrical test and characterization.

A prober is used in semiconductor production and development settings where individual device sites must be contacted for measurement or verification.

What do the numbers mean?

Power & electrical3

Voltage
210 VAC, Single Phase[2]
Accurate?
Frequency
50 / 60 Hz[2]
Accurate?
Full Load Amps
12.4 A[2]
Accurate?

Vacuum & pumping1

Vacuum Requirement
Over −80 kPa[2]
Accurate?

Configuration & options6

Air Requirement
Over 0.6 MPa[2]
Accurate?
Wiring Configuration
2-wire + Ground[2]
Accurate?
Main Breaker Rating
15 A[2]
Accurate?
Largest Motor Load (Ampere Rating)
7 A[2]
Accurate?
Short Circuit Current Rating
5 kA[2]
Accurate?
Vintage
2013[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Vacuum RequirementOver −80 kPa[2]
  • Voltage210 VAC, Single Phase[2]
  • Frequency50 / 60 Hz[2]
  • Full Load Amps12.4 A[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

Why is probing done at the wafer level?General reference — not yet source-verified

Wafer-level probing helps identify good and bad devices early, supports process monitoring, and reduces unnecessary downstream processing of defective material.

What is the basic operating principle of this machine class?General reference — not yet source-verified

The machine aligns probe contacts to target pads on the wafer, establishes temporary electrical contact, and passes signals to test electronics for measurement and analysis.

Not publicly documented

The following facts about the FP 3000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FP 3000 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the FP 3000 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the FP 3000 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the FP 3000 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the FP 3000 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
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Last updated Oct 13, 2026.

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