KLA
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The KLA 1007 positions a wafer on a precision chuck that moves the wafer under a probe card. The probe card contains fine needles that align to the bond pads of each die. The machine then lowers the card to make contact, enabling electrical tests to be performed by a test head connected to the system.
Wafer probers are used in the semiconductor test flow after wafer fabrication is complete and before the wafer is diced into individual chips. The KLA 1007 performs sort testing at the wafer level, identifying known good die and marking defective die for rejection.
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The following facts about the 1007 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 1007 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 1007 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 1007 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 1007 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 1007 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Aug 13, 2026.
The Electroglas 1034 Prober is a semiconductor wafer prober manufactured by Electroglas.
The Signatone 1160 is a probe station microscope for viewing samples and parametric probing of devices.