Accretech
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Wafer probers position a wafer on a temperature-controlled chuck and align precision probe needles to the bond pads of each die.
The manipulator provides fine X-Y-Z and theta adjustments to bring the probes into contact with the wafer, enabling electrical measurements on individual die.
The UF 200 SA sits in the test and sort stage of semiconductor manufacturing, after wafer fabrication and before dicing and packaging.
The UF 200 SA is applied in wafer-level testing of integrated circuits, including parametric test and functional sort.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
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The following facts about the UF 200 SA are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UF 200 SA are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UF 200 SA are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UF 200 SA are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UF 200 SA are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UF 200 SA is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 12, 2026.
The Signatone CM-210 is a 200mm high precision manual probe system designed for on-wafer analytical measurements including DC, CV/IV, high power, and RF test.
The Tenney TPS JR-A-F4T is a junior compact temperature test chamber with a 1.2 cubic foot chamber size and a temperature range of -68°C to +180°C.
The Rorze 03 RR 8120-001-001 is a wafer exchanger for 8-inch wafers.