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AJA

BSG-200

Substrate holder200mmAJA BSG-200 family
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BSG-200 — web.archive.org
Fig. 01BSG-200web.archive.org[1]

What is it?

The AJA BSG-200 Series Substrate Holder is described as handling wafers or similar planar substrates up to 200 mm in diameter, with direct backside He, Ar, or N2 gas cooling while rotating. The source also states that it is load-lock compatible and that it uses a peripheral weight ring to maintain higher backside gas pressure for heat transfer to the water-cooled platen.

What can it run?

Process applications and technology nodes documented for this tool.

  • Used as a rotating wafer table with backside gas cooling in an ion milling process
  • Handling wafers or similar planar substrates

What do the numbers mean?

Vacuum & pumping1

Pressure-enhancement feature
Peripheral weight ring around the outer edge of the substrates to maintain a 2 orders of magnitude higher backside gas pressure[1]
Accurate?

Wafer handling2

Type
Substrate holder[1]
Accurate?
Handled substrate size
Wafers or similar planar substrates up to 200 mm in diameter[1]
Accurate?

Gas & chemistry1

Cooling
Direct backside He, Ar or N2 gas cooling while rotating[1]
Accurate?

Configuration & options2

Model
BSG-200[1]
Accurate?
Load-lock compatibility
Load-lock compatible[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • CoolingDirect backside He, Ar or N2 gas cooling while rotating[1]
  • Pressure-enhancement featurePeripheral weight ring around the outer edge of the substrates to maintain a 2 orders of magnitude higher backside gas pressure[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the BSG-200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the BSG-200 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the BSG-200 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the BSG-200 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the BSG-200 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the BSG-200 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]General 2 — AJA International, Inc. Sputtering Tools and Systems — web.archive.orgweb.archive.org
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Last updated Jul 29, 2026.

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The AJA BSG-200 Series is a substrate holder for wafers or similar planar substrates up to 200 mm in diameter with direct backside gas cooling while rotating.

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